Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI

Product Details
After-sales Service: 1 Year
Condition: New
Speed: High Speed
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  • Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
  • Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
  • Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
  • Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
  • Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
  • Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
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  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
DB-141A
Precision
Precision
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Weight
1100kg
Dimensions(W X D X H)
1240 X 1160 X 1830mm
Magazines
2 PCS
Wafer Ring Size
6 Inch*2 & 8 Inch
Trademark
minder-hightech
Origin
China

Product Description

Product Description

 

DB-141A
Automatic High Precision Die Bonder

Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
Applications
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Specifications
No. Description Parameter
1 XY Placement accuracy +/-5 um @3 sigma
2 Die rotation accuracy +/-0.5° @3 sigma
3 Bonding force 20 gf ~ 200 gf
4 Cycle time 6 s
5 Dispensing system Epoxy Stamping
6 Ejector module 1 set
7 Wafer ring size 6 inch*2 & 8 inch
8 Optics module 4X lens / 500w camera /
FOV:2.1x1.7mm / Precision:0.8um
9 Substrate size Width:50~100 mm / Length:50~200 mm
10 Magazines 2 pcs
11 Applications Devices / Lidar / Sensor / SIP / MEMS...
12 Power Supply 200-240V~3.5A, 50-60Hz
13 Pneumatic CDA:0.5~0.6Mpa / VACUUM:-60~-80KPa
14 Dimensions(W x D x H) 1240 x 1160 x 1830mm
15 Weight 1100kg

Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
We have 16 years of experience in equipment ,
and can provide you with a one-stop IC Package Line Equipment solution

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