Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Model NO.: DB-141A
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Trademark: minder-hightech
• Origin: China

Product Description

DB-141A
Automatic High Precision Die Bonder

Applications

Specifications

No.	Description	Parameter
1	XY Placement accuracy	+/-5 um @3 sigma
2	Die rotation accuracy	+/-0.5° @3 sigma
3	Bonding force	20 gf ~ 200 gf
4	Cycle time	6 s
5	Dispensing system	Epoxy Stamping
6	Ejector module	1 set
7	Wafer ring size	6 inch*2 & 8 inch
8	Optics module	4X lens / 500w camera / FOV:2.1x1.7mm / Precision:0.8um
9	Substrate size	Width:50~100 mm / Length:50~200 mm
10	Magazines	2 pcs
11	Applications	Devices / Lidar / Sensor / SIP / MEMS...
12	Power Supply	200-240V~3.5A, 50-60Hz
13	Pneumatic	CDA:0.5~0.6Mpa / VACUUM:-60~-80KPa
14	Dimensions(W x D x H)	1240 x 1160 x 1830mm
15	Weight	1100kg

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