Mdax-898zd Customized High Precision Semiconductor Die Bonder for IC Package

• After-sales Service: 1 Year
• Condition: New
• Speed: Super High Speed
• Model NO.: MDAX-898ZD
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Trademark: minder-hightech
• Origin: China

Product Description

MDAX-898ZD Customized high precision semiconductor die bonding machine

This model is a solid-state SMT machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips MDAX-898ZD high-speed solidification machine, composed of multiple subunit modules: 1, Direct drive solid crystal bonding head with rotating suction nozzle 2, Multi pin design for easy adaptation to different types and sizes of wafer chips 3, 1.3 million resolution visual system for positioning chips and frames 4, Servo linkage direct connection high-precision adhesive system, capable of drawing adhesive 5, Manual loading and unloading vehicles 6, Solid crystal workbench module, using linear motor and high-precision grating ruler 7, Crystal ring can be used for 8-inch and 6-inch crystal wafers (automatic ring expansion function)


High speed: According to customer process requirements, achieve the fastest speed in the industry SMT accuracy: According to customer process requirements, achieve the highest accuracy in the industry (lithography board+chip) Surface mounting angle accuracy: ± 1.5 ° Pressure regulation: adjustable from 20g to 300g Linear structure bonding head Multiple image positioning schemes (appearance, feature points, edge finding, circle finding) First adhesive dot diameter control detection Connected mode device, multiple serial devices complete device packaging Capable of dispensing and drawing glue Automatic ring expansion function
 

Glue dispensing and drawing interface:
Easy and convenient to operate, with multiple commonly used glue drawing methods

Feature

1. Multiple image positioning schemes (appearance, feature points, edge finding, circle finding).

2. High speed: According to customer process reguirements, achieve the fastest speed in the industry.

3. Surface mounting angle accuracy: + 1.5 ° ; linear structure bonding head ; Automatic ring expansion function

4. Pressure regulation: adjustable from 20g to 300g ; Control and testing of the diameter of the first adhesive point

5. Capable of dispensing and drawing glue ; Connected mode device, multiple serial devices complete device packaging.

6. SMT accuracy: According to customer process reguirements, achieve the highest accuracy in the industry (lithography board+ chip)
 

Specification

Model	MDAX-898ZD
UPH	2K Pcs (Chip related)
X,Y Surface mount position accuracy	+15-20um
Surface mounting angle accuracy	+1.5°
Surface mounting pressure range and accuracy	20~300g ±10%
Ring size and adaptability	8inch,6inch Wafer (with automatic ring expansion)
Maximum camera accuracy	1um
Camera field of view	1.0mm~8mm
Number of suction nozzles	1PCS
Number of thimbles	1PCs, Multi pin (optional)
Vehicle size range	Width:40mm~90mm , Length:120mm~320mm
Console height	950mm±30mm
Power supply	AC 220V/50Hz
Power consumption	800w
Compressed gas	4~6 Bar
Net weight	800 Kg