Purpose and characteristics: Mainly used for the development and production of small and medium-sized integrated circuits, semiconductor components, optoelectronic devices, surface acoustic wave devices, thin film circuits, and power electronic devices. This machine is a double-sided contact exposure machine, with a specially designed reprinting mechanism that can eliminate substrate wedge errors and ensure good contact between the upper and lower mask plates on the upper and lower sides of the substrate, thereby ensuring the exposure quality of the upper and lower sides of the substrat. 1.Energy required for equipment: Mainframe power supply: 220V, 50HZ, power consumption≤1.5KW; 2.Equipped with a vacuum pump with a power supply of 220V; 3.Size and weight: Size:1200(length)×720(width)×1500(high). Weight ≤170kg; 4.Place the machine body on a dedicated workbench; 5.Exposure type: contact type, plate alignment, double-sided exposure; 6.Exposure area:φ100mm; 7.Uneven exposure: ≤±3%; 8.Exposure intensity: ≥5mw/cm2; 9.Exposure resolution: 2μm; 10.Exposure mode: Double sided simultaneous exposure; 11.Alignment range: X: ±5mm Y:±5mm; 12.Engraving accuracy: 2μm; 13.Rotation range: Q-direction rotation adjustment≤±5°; 14.Microscopic system: dual field of view CCD system, objective lens 1.6X~10X, computer image processing system, 19"LCD monitor; 15.Mask size: Capable of vacuum adsorption
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