Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass Semiconductor

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Customized: Customized
Diamond Member Since 2017

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1000000 RMB
  • Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass Semiconductor
  • Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass Semiconductor
  • Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass Semiconductor
  • Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass Semiconductor
  • Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass Semiconductor
  • Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass Semiconductor
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Basic Info.

Layout
Vertical
Automatic Grade
Automatic
Power Source
Electric
Cutting Mode
Plasma Cutting
Specification
560*452*186mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Product Description
Summary
SPA-2600 Atmospheric Plasma Cleaner is a product for surface cleaning, activation and etching in a normal pressure environment,The nozzles usually equipped with jet straight spray gun heads mainly treatment materials with small area, high trajectory accuracy, and corners parts,it can effectively deal with problems such as poor adhesion, poor welding, poor printing and poor dispensing in various industries.Plasma cleaning, as the front process of product surface printing, packaging, laminating, coating, welding, adhesive, coating, is an important part of enterprise product upgrade, capacity expansion and cost reduction.
Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorFeatures
Compact machine, wide application range, professional, efficient, accurate, durable, environmentally friendly, flexible
configuration, high cost performance;
Can be combined with the production line, can be continuously operated and increase production speed;

Low gas cost (CDA / N2), and saving costs;
Uses industry-leading Full-bridge inverter circuit;
Patented design high voltage generator;
Patented nozzle design, no ESD generation;
Unique patented discharge technology, high plasma concentration

Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorIndustry applications
3C industry: mobile phone assembly bonding, camera module, headphone bonding, middle frame bonding
Display Industry: TP Bonding
Automotive industry bonding: headlights, steering wheels, EPDM seals, windshield glass, automotive electronics
Connector industry: cable character printing
Watch industry: bonding, inlaying, agglutinate
Plastic industry: surface activation, bonding, screen printing
Metal industry: gold plating, silver plating, welding, removal of residual organic matter
Glass industry: coating, ink printing, coating, paste

Details Images
Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorDirect Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorDirect Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorSpecification
Plasma power host specifications
Dimension 560×452×186mm(L×W×H)
Weight 20KG
Input power Single phase 220V,50/60Hz,Ground resistance<0.5Ω
Power frequency 20-50KHz
Plasma output power 300-500W Adjustable;
Optional 200-300W(Ultra-low power version TEMP:40-60ºC)
Control method I/O interface
Alarm Overload protection, short circuit protection, open circuit protection, temperature protection
Plasma power nozzle specifications
Nozzle specification 1. Optional ordinary jet direct injection 2mm, 3mm, 5mm, 10mm standard nozzle
2. Straight jet flat nozzle of 10 mm and 15 mm
Weight 3KG
Cleaning hight 5-20mm
Cleaning width 2-15mm
Cable length 3.5 m( Customizable within 6 m)
 
C power specifications Power:Single phase AC220V,50/60Hz,3 line,10A
Exhaust Flow :2.0 m³/min Pressure:-280~-350 Pa Material: corrosion-resistant material
Compressed air requirements Flow:25Lpm Pressure:3~7 kg/cm² tube dia:8×5 mm Material:PU tube
Dew point:Below -40ºC Particle>0.3μm:10Pcs/ft³
 
Equipment rate Continuous operation over 95%
Danger sign High voltage danger sign
Use environment TEMP:15~30ºC
Humidity:30~80%
Other considerations No flammable gas, corrosive gas, explosion or reactive dust
Packing & Delivery
Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorDirect Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorTo better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Our Factory
Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorDirect Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorDirect Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorOur Advantages
Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorOur customers
Direct Injection Type Atmospheric Plasma Cleaning Machine/Vacuum Plasma Surface Treater/Plasma Treatment for Glass SemiconductorIf you want to know more information about this machine, welcome to contact us
 

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