Semiconductor Package Chip Bonder To9 High-Speed Chip Mounter with Enhanced Placement Accuracy Features Eutectic Crystal Planting Die Bonding Machine

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Model NO.: MDAX-TOE10
• Precision: High Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Transport Package: Wooden Case
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 1000

Product Description

MDAX-TOE10
Customized fully automatic eutectic machine

This machine is a high-precision eutectic machine designed specifically for TO9 materials. It consists of multiple sub-unit modules:
1. Direct-drive solid crystal head, 360.nozzle rotation
2. Multi-pin design, convenient for adapting to wafer chips of different sizes
3. 1.3 million resolution visual system, positioning of wafers and frames
4. The base platform of the eutectic heating table adopts linear motor and high-precision grating ruler, with XY automatic correction function
5. Automatic loading and unloading carrier, the base loading has flip function
6. Wafer table module, using linear motor and high-precision grating ruler
7. The crystal ring can be used for 6-inch standard mother and child rings
8. Constant temperature eutectic table

Equipment structure introduction

Technical specifications

UPH	200 -400PCS(Chip related)
X, Y patch position accuracy	±10um
Patch angle accuracy	±1°
Patch pressure range and accuracy	20~300g ±10%
Crystal ring size and adaptability	8inch,6inch Wafer
Maximum camera accuracy	1um
Camera field of view	1.0mm~8mm
Number of nozzles	1PCS
Number of top pins	2PCS, multi pin (optional)
Eutectic Materials	TO9
Attachment materials	Heat sink, chip
Eutectic table size range	Width:12mm  Length:12mm
Operating table height	950mm±30mm
Visual quantity	6 sets
Power supply	AC 220V/50Hz
Power consumption	1200 W
Compressed gas	4~6 Bar
Overall dimensions (WXDXH) (excluding loading and unloading machines)	1600*1300*1900mm
net weight	1200 Kg

Equipment performance characteristics
High speed: According to customer process requirements, the speed is the fastest in the industry
Accuracy: According to customer process requirements, the accuracy isthe highest in the industry (photolithography board + chip)
Accuracy: XY accuracy, ±10um, angle, ±1.
Pressure adjustment: 20g~300g adjustable
Linear head (360.rotating nozzle)
Various image positioning solutions (appearance, feature points, edge search, circle search)
CPK quality tracking detection
Constant temperature heating platform
Mapping image index function
Detection of debris or serious defects before eutectic
Detection of chip position and angle after solidification
Product classification, process parameter storage function

Application of multiple visual algorithms
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.