Product Overview: MDHWS641 series ultrasonic scanning microscope is a kind of non-destructive testing imaging equipment using ultrasound as the media. It mainly uses high-frequency ultrasound to detect all kinds of semiconductor devices and materials, and can detect the defects such as holes, cracks inclusions delamination inside the sample, and display them in a graphical way. In the scanning process, it will not cause damage to the sample, will not affect the performance of the sample, and can effectively meet the needs of new energy, power electronics, thermal management materials, diamond composite materials, carbon fiber composite materials and other industries. Industry application: Suitable for water-cooled radiator, lGBT module, ceramic substrate, diamond composite material, carbon fiber composite material, electrical welding parts, ceramic material, target material and other fields.
Product Overview: MDHWS321 series ultrasonic scanning microscope is a non-destructive testing imaging equipment suitable for semiconductor industry. It mainly uses high frequency ultrasound to detect all kinds of semiconductor devices and materials, and can detect defect such as pores, cracks, inclusions and delamination inside samples, and display them in agraphical way. During the scanning process, it will not cause damage to the sample and will not affect the performance of the sample. Industry application: Suitable for plastic sealed lC, photoelectric device, microwave power device, MEMS device, flip chip, Stacked Die, MCM multi-chip module, diamond composite sheet, electrical welding parts, ceramic materials and other fields of defect analysis.
Product features:
With A scan, B scan, C scan, multi-layer scanning, transmission scanning (need to configure transmission scanning unit and receiving probe options), multi-layer scanning, tray-tray scanning, thickness measurement andother series of scanning modes.
With quantitative measurement and analysis function, visually display the position, shape and size of the intemal defects of the tested parts in the form of images, and carry out the size and area statistics of the defects, and automatically calculate the percentage of defects in the measured area; With defect size identification: Thickness and ranging functions
With image coloring function, can automatically color according to phase reversal; Manual coloring according to gray level. Automatic coloring according to thickness changes
Suitable for the rapid scanning analysis of a single device, can also be placed in batches of samples synchronous defect identification, quickly screen out unqualified products.
Compatible with 1-230MHz ultrasonic probe.
Testing software independent research and development, English and Chinese interface, can be continuously upgraded according to customer needs.
FAQ
1. About Price: All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
2. About Sample: We can provide sample production services for you, but you may provide some fees.
3. About Payment: After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
4. About Delivery: After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
5. Installation and Debugging: After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
6. About Warranty: Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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