After-sales Service: | 1 Year |
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Demoulding: | Automatic |
Condition: | New |
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Cutting head | X direction | Travel range: 160mm | Roller pressure | 0~100gf |
Positioning accuracy: 3 μ m | Knife pressure | 0~20gf | ||
Y direction | Travel range: 160mm | Equipment weight | About 150kg | |
Positioning accuracy: 3 μ m | Lens Y direction | Travel range:160mm | ||
T direction | 360 degree rotation | External dimensions | 1170mmx730 mmx500mm | |
Wafer size | Suitable for 6-inch (150mm) wafers | Operation interface | 23.8 "TFT color screen, Chinese interface | |
Image system | 4.0X magnification (2.0X optional) | Control system | Windows 7 operating system, dedicated control software for cleavage machines | |
Standard configuration | Host \ Computer \ 23.8 "Display \ ESD Splitting Machine Control Software \ Mouse and Keyboard |