Wafer Cleaving Equipment Automatic Wafer Scriber Breaker Wafer Cleaving Wafer Cleavage Scribe and Break Equipment

Product Details
After-sales Service: 1 Year
Demoulding: Automatic
Condition: New
Diamond Member Since 2017

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Registered Capital
1000000 RMB
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Basic Info.

Model NO.
MD
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Desktop
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Case
Trademark
MD
Origin
China
Production Capacity
1000

Product Description

Automatic Wafer Scribe and Break System:
Suitable for compound semiconductor wafer materials such as GaAs, InP, etc. with a size of 6 inches or less, automatic cutting and cleavage specialized equipment. Widely used in laser devices, photodetectors, and microwave devices for cleavage segmentation.

 
Cutting head X direction Travel range: 160mm Roller pressure 0~100gf
Positioning accuracy: 3 μ m Knife pressure 0~20gf
Y direction Travel range: 160mm Equipment weight About 150kg
Positioning accuracy: 3 μ m Lens Y direction Travel range:160mm
T direction 360 degree rotation External dimensions 1170mmx730   mmx500mm
Wafer size Suitable for 6-inch (150mm) wafers Operation interface 23.8 "TFT color screen, Chinese interface
Image system 4.0X magnification (2.0X optional) Control system Windows 7 operating system, dedicated control software for cleavage machines
Standard configuration Host \ Computer \ 23.8 "Display \ ESD Splitting Machine Control Software \ Mouse and Keyboard

One-stop Solution for Semicon Industry Equipments Line
Wafer Cleaving Equipment Automatic Wafer Scriber Breaker Wafer Cleaving Wafer Cleavage Scribe and Break EquipmentWafer Cleaving Equipment Automatic Wafer Scriber Breaker Wafer Cleaving Wafer Cleavage Scribe and Break EquipmentWafer Cleaving Equipment Automatic Wafer Scriber Breaker Wafer Cleaving Wafer Cleavage Scribe and Break EquipmentWafer Cleaving Equipment Automatic Wafer Scriber Breaker Wafer Cleaving Wafer Cleavage Scribe and Break EquipmentWafer Cleaving Equipment Automatic Wafer Scriber Breaker Wafer Cleaving Wafer Cleavage Scribe and Break EquipmentFAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 

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