Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test

Product Details
After-sales Service: 1 Year
Function: Bond Tester Shear Tester
Demoulding: Automatic
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Year of Establishment
2014-12-30
Address
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, ...
Registered Capital
1,000,000 RMB
  • Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
  • Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
  • Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
  • Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
  • Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
  • Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Find Similar Products
  • Overview
  • Product Description
  • Specification
  • Industry Segments
  • Factory and Equipment Real Shot
  • Packing & Delivery
  • Company Profile
  • FAQ
Overview

Basic Info.

Model NO.
MD-BT101
Condition
New
Certification
CE
Warranty
1 Year
Automatic Grade
Automatic
Installation
Desktop
Driven Type
Electric
Transport Package
Wooden Case
Specification
L: 500mm W: : 550mm H: : 440mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Packaging & Delivery

Package Size
90.00cm * 60.00cm * 60.00cm
Package Gross Weight
90.000kg

Product Description

Product Description
Multifunctional Bond Tester
The push-pull force testing machine can perform strength testing of wire bonding after microelectronic wire bonding, adhesion testing between solder joints and substrate surfaces, and repetitive thrust fatigue testing of solder balls (internal wire tension testing, micro solder joint thrust testing, gold ball thrust testing, chip shear force testing, SMT soldering component thrust testing, BGA matrix overall thrust testing). The multifunctional push-pull force testing machine is widely used in LED packaging testing, IC semiconductor packaging testing, TO packaging testing, IGBT power module packaging testing, optoelectronic component packaging testing, automotive field, aerospace field, research institution testing, and various universities' testing and research applications.
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Equipment characteristics
1. All sensors adopt high-speed dynamic sensing and high-speed data acquisition systems to ensure the accuracy of test data.
2. Adopting the company's unique high-resolution (24BitPlus ultra high resolution) data acquisition system.
3. Adopting the company's unique safety limit and speed limit technology, making the operation easy and convenient.
4. Adopting the company's unique intelligent lighting control and adjustment system to reduce the damage of light sources to vision.
5. Equipped with a high-definition observation microscope as standard, reducing visual fatigue for personnel.
6. Dual rocker 4 way operation and user-friendly software configuration make operation simple and convenient.
7. Combining the unique design of ergonomics, making use more comfortable.
8. Comprehensive protective measures for equipment to avoid damage caused by personnel's mis operation
9. Strong R&D capabilities, providing customized products according to customer needs.
10. Attentive after-sales service ensures that users have no worries or concerns.
Specification
Equipment model
MD-BT101
Testing accuracy
Sensor accuracy+0.003%: comprehensive testing accuracy+0.25%
Test scope
Configure different range testing modules according to customer products
Working mode
Push and pull the needle 180 degrees vertically in contact with the test product to ensure the accuracy of the data
Sensor replacement method
Manually replace the test module
operating system
Control system+Windows operating interface
Platform fixture
The machine can share various fixtures, and the fixtures can rotate 360 degrees
X-axis stroke
100mm
X-axis resolution
+/-0.125um
Y-axis stroke
100mm
Y-axis resolution
+/-0.125um
Z-axis stroke
80mm
Z-axis resolution
+/-0.001mm
power supply
220V±5%
power
300W(MAX)
External dimensions
L: 500mm W: :550mm H: :440mm
weight
90kg
Equipment model
MD-BT104
External dimensions
680*580*710(Including left and right rocker rods)
Equipment weight
95KG
Power supply
110V/220V  @4.0A  50/60HZ
compressed air
4.5-6Bar
Vacuum output
500mm Hg
Control computer
Lenovo PC
Software operation
Windows7/Windows10
microscope
Standard binocular continuous zoom microscope (optional three eye microscope)
Sensor replacement method
Automatic switching
Platform fixture
360 degree rotation, platform can share various testing fixtures
XY-axis effective stroke
100*100mm
Z-axis effective stroke
80mm
XY axis resolution
±1um Z-axis resolution±1um
Sensor accuracy
Sensor accuracy ± 0.003%; Comprehensive testing accuracy ± 0.25%.
Industry Segments

Semiconductor packaging, TO series packaging, LED packaging, IGBT packaging, Microelectronic packaging.
The multifunctional push-pull testing machine is widely used in applications such as LED packaging testing, IC semiconductor packaging testing, TO packaging testing, IGBT power module packaging testing, optoelectronic component packaging testing, automotive, aerospace,  research institutions' testing, and various universities' testing and research
Factory and Equipment Real Shot
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Packing & Delivery
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
Company Profile

Since 2014,Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. 
We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.
Automated Wafer Bond Tester / Wire Bond Pull Shear Tester / Die Shear Test
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
 
2. About Sample:
We can provide sample production services for you, but you may provide some fees.
 
3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
 
4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
 
5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
 
6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 
7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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