Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine

Product Details
After-sales Service: 1 Year
Function: Wire Bonder
Demoulding: Automatic
Diamond Member Since 2017

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Year of Establishment
2014-12-30
Registered Capital
147802.18 USD
  • Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
  • Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
  • Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
  • Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
  • Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
  • Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
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Basic Info.

Model NO.
MDZW-BW1880
Condition
New
Certification
CE
Warranty
12 Months
Automatic Grade
Manual
Installation
Desktop
Transport Package
Wooden Case
Trademark
minder-hightceh
Origin
China
Production Capacity
1000

Product Description

MDZW-BW1880 
Manual-Semi Ball&Wedge 2 in 1 Bonder
Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding MachineLaboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding MachineLaboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
Product Features
1. Fixed arc height, fixed line length, automatic arc starting, improve line arc consistency
2. Real-time monitoring of solder joint deformation, effectively guaranteeing the quality of bonding solder joints
3. Manual/semi-automatic function online switching, flexible and convenient, better product compatibility
4. Ball planting wireless tail/BSOB/BBOS/adding ball position/pad ball position can be set online, automatic point alignment
5. Ball welding and wedge welding are integrated, convenient and fast switching
Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding MachineLaboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding MachineLaboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
Performance Indicators 
XYZ axis Travel 15mm*15mm*18mm
Wire diameter Gold wire 18-75um;Platinum wire 18-25um;Aluminum wire 18-80mm;Gold belt 25*12.7μm-300*25.4μm
Cavity depth compatible with 16/19mm ball welding splitter 16/19/25/32mm wedge welding splitter;Cavity depth up to 21mm
Bonding pressure 5-150g, accuracy 0.1g, online programmable
Ultrasonic power 0-5W, 1000 times subdivision
Device size compatible with more than 200mm
Lifting platform size 250mm*250mm*18mm
Spool size compatible with both 1/2-inch and 2-inch spools
Overall dimensions 750mm W*580mm D*500mm H
Weight 80KG
Power supply AC220V±10%@50HZ, 10A, less than 500W
Compressed air >0.2MPa, purified air source

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 
Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
Laboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding MachineLaboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding MachineLaboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding MachineLaboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding MachineLaboratory IC Packaging Equipment Manual Semi Ball Wedge 2 in 1 Bonder Wire Ball Bonding Machine
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.



 

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