Semiconductor Packaging Integrated Circuits Gold Wire Bonding Manual-Semi-Auto Ball Bonder

• After-sales Service: 1 Year
• Function: Wire Bonder
• Demoulding: Automatic
• Model NO.: MDZW-BB1850
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Manual
• Installation: Desktop
• Driven Type: Electric
• Transport Package: Wooden Case
• Trademark: minder-hightceh
• Origin: China
• Production Capacity: 1000

Product Description

MDZW-BB1850
Manual-Semi-Auto Ball Bonder


Product Features
1. Real-time monitoring of solder joint deformation, effectively ensuring the quality of bonding solder joints
2. Manual/semi-automatic function online switching, flexible and convenient, better product compatibility
3. Ball wireless tail/BSOB/BBOS/add ball position/pad ball position can be set online, automatic point
4. Automatic tail retention, automatic ignition, no need to lift the handle , higher efficiency
5. 360-degree wire bonding, consistent solder joint energy output
Performance Indicators 

XYZ axis	Travel 15mm*15mm*18mm
Wire diameter	Gold wire 18-50um,Platinum wire/platinum iridium wire 18-25um
Cavity depth	Compatible with 16/19mm ball welding cutter,Cavity depth up to 11mm
Spool size	Compatible with 1/2 inch and 2 inch spools
Bonding pressure	5-150g, online programmable
Ultrasonic power	0-5W, 1000 times subdivision
Device size	Compatible with more than 200mm
Lifting platform size	250mm*250mm*18mm
Machine dimensions	750mm W * 580mm D * 500mm H
Weight	80KG
Power supply	AC220V±10%@50HZ, 10A, less than 500W
Compressed air	>0.2MPa, purified air source

Product advantages
1. High-efficiency ultrasonic transducer system, solder joint deformation is fuller and more complete
2. Ball planting zero tail wire/BBOS/BSOB is completed automatically
3. Segmented welding, which can adapt to the bonding of uneven or inclined chips
4. 360-degree directional wire bonding, consistent solder joints
5. With the coordination of wire clamp action, it is easy for operators to start arcs, and the requirements are lower
6. By optimizing the reversal height and reversal distance, long wire arc operations of more than 3mm can be completed
7. Real-time monitoring of solder joint deformation, quality assurance, and high consistency
8. Wire arrangement function, manually complete the first wire, and automatically complete the rest of the wire bonding, with high efficiency


Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.