Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine

Product Details
After-sales Service: 1 Year
Function: Wire Bonder
Demoulding: Automatic
Diamond Member Since 2017

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Year of Establishment
2014-12-30
Registered Capital
147802.18 USD
  • Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
  • Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
  • Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
  • Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
  • Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
  • Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
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Basic Info.

Model NO.
MDZW-BW1880
Condition
New
Certification
CE
Warranty
12 Months
Automatic Grade
Manual
Installation
Desktop
Transport Package
Wooden Case
Trademark
minder-hightceh
Origin
China
Production Capacity
1000

Product Description

MDZW-BW1880 
Manual-Semi Ball&Wedge 2 in 1 Bonder
Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding MachineSemiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding MachineSemiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
Product Features
1. Fixed arc height, fixed line length, automatic arc starting, improve line arc consistency
2. Real-time monitoring of solder joint deformation, effectively guaranteeing the quality of bonding solder joints
3. Manual/semi-automatic function online switching, flexible and convenient, better product compatibility
4. Ball planting wireless tail/BSOB/BBOS/adding ball position/pad ball position can be set online, automatic point alignment
5. Ball welding and wedge welding are integrated, convenient and fast switching
Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding MachineSemiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding MachineSemiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
Performance Indicators 
XYZ axis Travel 15mm*15mm*18mm
Wire diameter Gold wire 18-75um;Platinum wire 18-25um;Aluminum wire 18-80mm;Gold belt 25*12.7μm-300*25.4μm
Cavity depth compatible with 16/19mm ball welding splitter 16/19/25/32mm wedge welding splitter;Cavity depth up to 21mm
Bonding pressure 5-150g, accuracy 0.1g, online programmable
Ultrasonic power 0-5W, 1000 times subdivision
Device size compatible with more than 200mm
Lifting platform size 250mm*250mm*18mm
Spool size compatible with both 1/2-inch and 2-inch spools
Overall dimensions 750mm W*580mm D*500mm H
Weight 80KG
Power supply AC220V±10%@50HZ, 10A, less than 500W
Compressed air >0.2MPa, purified air source

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 
Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
Semiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding MachineSemiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding MachineSemiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding MachineSemiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding MachineSemiconductor Packaging Equipment Bsob Bbos Manual Semi Ball Wedge Wire Bonder Ball Welding Wedge Welding Machine
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.



 

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