• Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package
  • Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package
  • Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package
  • Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package
  • Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package
  • Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package

Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package

Function: Abrasion Resistance
Certification: CE
Warranty: 12 Months
Automatic Grade: Semiautomatic
Installation: Vertical
Driven Type: Electric
Diamond Member Since 2017

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  • Overview
  • Product Description
  • Product Parameters
  • Company Profile
Overview

Basic Info.

Mould Life
>1,000,000 Shots
Transport Package
Minder-Hightech
Trademark
minder-hightech
Origin
China
Production Capacity
100

Product Description

Product Description

Microwave Plasma Cleaner
SPV-100MWR is a low voltage microwave plasma cleaning system for semiconductors. By applying microwave with the frequency of 2.45GHz to the window on the wall of the vacuum cavity, a large number of continuous Plasma is generated, and the chip is cleaned by entering the cavity.

Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package
Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package

Product Parameters
Vacuum plasma host
Equipment size 1230X1800X1100mm (width x height x depth)
Weight 450kg
Power demand AC380V, 50/60Hz, 5-wire, 30A
Plasma generator specifications
Microwave power supply Power 0~1250W
Frequency 2.45GHz
Vacuum system
Material Aluminum alloy (customizable stainless steel chamber)
Thickness 25mm
Internal dimensions of the cavity 480mmX470mmX480mm
Workspaces 6 magazine sections
ECR Slotted Magazine provides ECR enhanced processing effect
Plasma capability
Processing ability 35um Pitch
40μm Bump
15X15mm Maximum Die size
Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package

 

  
Company Profile

 

Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package

Vacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to PackageVacuum Microwave Plasma Cleaning Machine Plasma Surface Treatment Semiconductor Packaging Solution IC to Package

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