Electronic Semiconductor Industry Specialized Laser Equipment Laser Scribing Systemtechnical Solution

• After-sales Service: 1 Year
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Weight: 1200kg
• Size: 1200*1400*1900
• X-Axis and Y-Axis Scoring Range: 200X200mm
• Transport Package: 1200*1400*1900
• Specification: 1200kg
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

Product Description

Laser Scribing System Technical Solution

Main features of the equipment:
1. Adopting a 355nm UV laser, which is a product with independent intellectual property rights and holds an American invention patent, it has stable performance, good spot mode, and can work stably for a long time.
2. Up and down CCD configuration, suitable for transparent and semi transparent wafer positioning.
3. The laser beam focuses on a fine spot, with a maximum of 4 μm and a depth of ≥ 25 μm.
4. Reliable and high-precision X-Y - θ workbench.5. Efficient and flexible software operating system, intuitive interface, and easy operation.

Precision 3D platform:
1. Full closed-loop control, the repeated positioning accuracy of X and Y axes reaches ± 1 μm, and the positioning accuracy of θ axis is ± 15 ″.
2. X-axis and Y-axis scoring range: 200X200mm.
3. Excellent acceleration and deceleration performance, effectively improving the system's production capacity per unit time.

Up and down CCD configuration
The workbench is equipped with one CCD system on both the top and bottom, which can locate the front and back MARK points of the wafer.
Laser characteristics:

1.Full closed-loop control ensures displacement error within ± 1 µ m throughout the entire travel range.

2.We use imported high-quality laser pump sources.

3.Advanced high conversion efficiency laser cavity optical design.

4.Provide stable high-power laser output at high frequencies.

5.Industrialized module design ensures long-term work stability. (Ensure time ≥ 10000 hours)

Operating software and functional characteristics
Three point rounding and chip filtering: Calculate the circular contour of a circular wafer, generate an appropriate chip cutting path, and filter out the chip fragments to avoid scratching the blue film outside the wafer (as shown in the figure below).



Scratching effect
The high-speed cutting seam width is guaranteed to be within 9 µm, providing the possibility of increasing chip production capacity, providing almost vertical laser cutting effect, and maximizing the guarantee of chip shape after cracking.

Technical parameters


Smoke and dust filtration system (optional)