After-sales Service: | 1 Year |
---|---|
Condition: | New |
Certification: | CE |
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Customization for reel to reel wire bonding for sim card
Speed:
21W/S for 2mm
Welding line area:56*80mm
Leadframe width:28-90mm
Application:
IC(SOP,SOT,DIP,BGA,COB.)
LED(SMD,COB)
Advantage:
Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption
The chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution
0.1um,+/-2um(High resolution 0.1um worktable, + / - 2umwelding line accuracy
EFO(High resolution EFO
Full closed loop force control
2.5mil copper wire
Optional Automatic conversion of product types
Specification |
|
Bonding Capability |
48ms/w 2mm Wire Length |
Bongding Speed |
+/-2Ym |
Wire Length |
Max 8mm |
Wire Diameter |
15-65ym |
Wire Type |
Au,Ag,Alloy,CuPd,Cu |
Bonding Process |
/BSOB/BBOS |
Looping Control |
(Ultra Low Looping)<50ym |
Bonding Area |
56*80mm |
XY(XY Resolution) |
0.1um |
(Ultrasonic Frequence) |
138KHZ |
(PR accuracy) |
+/-0.37um |
(Applicable Magazine) |
|
(L) |
120-305mm |
(W) |
36-98mm |
(H |
50-180mm |
(Pitch |
Min 1.5mm |
(Applicable Leadframe |
|
L |
100-300mm |
W |
28-90mm |
T |
0.1-1.3mm |
Conversion Time |
|
Different Leadframe |
<15min |
Same Leadframe |
<4min |
Operation Interface |
|
MMI Language |
Chinese,Enghise |
Dimension, Weight |
|
Overall Dimension)W*D*H |
950*920*1850mm |
Weight |
750KG |
Facilities |
|
Voltage |
190-240V |
Frequency |
50Hz |
Compressed Air |
6-8Bar |
Air Consumtion |
80L/min |