Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine

Product Details
After-sales Service: 1 Year
Condition: New
Certification: CE
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  • Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine
  • Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine
  • Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine
  • Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine
  • Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine
  • Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine
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Basic Info.

Model NO.
MD-S818-R2R
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Trademark
minder-hightech
Origin
China
Production Capacity
100

Product Description

Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine
Reel to reel wire ball bonder for RFID

Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding MachineSemiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding MachineSemiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine

Customization for reel to reel wire bonding for sim card

Speed:

21W/S for 2mm

Welding line area:56*80mm

Leadframe width:28-90mm

Application:

IC(SOP,SOT,DIP,BGA,COB.)

LED(SMD,COB)

Advantage:

Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption

The chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution

0.1um,+/-2um(High resolution 0.1um worktable, + / - 2um

welding line accuracy

EFO(High resolution EFO

Full closed loop force control

2.5mil copper wire

Optional Automatic conversion of product types

Specification

Bonding Capability

48ms/w 2mm Wire Length

Bongding Speed

+/-2Ym

Wire Length

Max 8mm

Wire Diameter

15-65ym

Wire Type

Au,Ag,Alloy,CuPd,Cu

Bonding Process

/BSOB/BBOS

Looping Control

(Ultra Low Looping)<50ym

Bonding Area

56*80mm

XY(XY Resolution)

0.1um

(Ultrasonic Frequence)

138KHZ

(PR accuracy)

+/-0.37um

(Applicable Magazine)

(L)

120-305mm

(W)

36-98mm

(H

50-180mm

(Pitch

Min 1.5mm

(Applicable Leadframe

L

100-300mm

W

28-90mm

T

0.1-1.3mm

Conversion Time

Different Leadframe

<15min

Same Leadframe

<4min

Operation Interface

MMI Language

Chinese,Enghise

Dimension, Weight

Overall Dimension)W*D*H

950*920*1850mm

Weight

750KG

Facilities

Voltage

190-240V

Frequency

50Hz

Compressed Air

6-8Bar

Air Consumtion

80L/min

Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding MachineSemiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding MachineSemiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding MachineSemiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding MachineSemiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine
Semiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding MachineSemiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding MachineSemiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding MachineSemiconductor Customized Reel to Reel Wire Ball Bonder Wire Bonding Machine
We have 16 years of experience in equipment,
and we can provide you with a one-stop IC Package Line Equipment solution !!

 

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