Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Type: Rie
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  • Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching
  • Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching
  • Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching
  • Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching
  • Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching
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  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
MD150-RIE
Certification
CE
Etching Type
Double Spray
Precision
High Precision
Condition
New
Trademark
minder-hightech
Origin
China
Production Capacity
100

Product Description

Product Description

 

Reactive ion etching system
RIE
Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching
Applied materials:
Passivation layer: SiO2, SiNx
Backsilicon
Adhesive layer: TaN
Through hole: W

Feature:1. Etching of passivation layer with or without holes; 2. Etching of adhesive layer; 3. Back silicon etching


Project configuration and machine structure diagram
Item MD150-RIE MD200-RIE MD200C-RIE
Product size ≤6 inches ≤8 inches ≤8 inches
RF power source 0-300W/500W/1000W Adjustable,automatic matching
Molecular pump -/620(L/s)/1300(L/s)/Custom Antiseptic620(L/s)/1300(L/s)/Custom
Foreline pump Mechanical pump/dry pump Dry pump
Process pressure Uncontrolled pressure/0-1Torr controlled pressure
Gas type H/CH4/O2/N2/Ar/SF6/CF4/
CHF3/C4F8/NF3/Custom
(Up to 9 channels, no corrosive & toxic gas)
H2/CH4/O2/N2/Ar/F6/CF4/ CHF3/C4F8/NF3/Cl2/BCl3/HBr(Up to 9 channels)
Gas range 0~5sccm/50sccm/100sccm/200sccm/300sccm/500sccm/custom
LoadLock Yes/No Yes
Sample tem control 10°C~Room tem/-30°C~100°C/Custom -30°C~100°C /Custom
Back helium cooling Yes/No Yes
Process cavity lining Yes/No Yes
Cavity wall tem control No/Roomtem~60/120°C Room tem-60/120°C
Control System Auto/custom
Etching material Silicon-based:Si/SiO2/SiNx···
IV-IV: SiC
Magnetic materials/alloy materials
Metallic material: Ni/Cr/Al/Au.....
Organic material: PR/PMMA/HDMS/Organic
film......
Silicon-based: Si/SiO2/SiNx......
III-V(3): InP/GaAs/GaN......
IV-IV: SiC
II-VI (3): CdTe......
Magnetic materials/alloy materials
Metallic material: Ni/Cr/A1/Au......
Organic material: PR/PMMA/HDMS /organic film...

Process result
Silicon-based material etching
Silicon-based materials, nano-imprint patterns, array
patterns and lens pattern etching
Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching
InP normal temperature etching
Pattern etching of InP based devices used in optical communication, including waveguide structure, resonant cavity structure ridge structure etc
Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching
SiC material etching
Suitable for microwave devices, power devices, etc
Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching
Physical sputtering, etching  Organic materiale tching
It is applied to the etching of difficult to etch materials such as some metals (such as Ni / Cr) and ceramics, and the patternede tching of materials is realized by physical bombardment. It is used for etching and removal of organic compounds such as photoresist (PR)/ PMMA / HDMS / polymer
Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching

Cermet film material (Au/Ni/Cr/Al2O3)

 
 


Display of failure analysis results
Reactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching

Specification:
1. Prevent chips from flying
2. Minimum node that can be processed: 14nm;
3. SiO2/SiNx etching rate: 50~150 nm/min;
4. Etched surface roughness:<1 nm;
5. Support passivation layer, adhesion layer and back silicon etching;
6. Selection ratio of Cu/Al:>50
7. All-in-one machine LxWxH: 1300mmX750mmX950mm
8. Support one-click execution

Customer site:
Reactive Ion Etching System Rie Failure Analysis Silicon Based Material EtchingReactive Ion Etching System Rie Failure Analysis Silicon Based Material EtchingReactive Ion Etching System Rie Failure Analysis Silicon Based Material Etching





 

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