Laboratory Use Semiconductor 6 Inches Wafer Surface Grinding and Polishing Lapping Machine

• After-sales Service: 1 Year
• Warranty: 1 Year
• Type: Stone Polishing Machine
• Model NO.: MD
• Control: CNC
• Automation: Semi-automatic
• Precision: High Precision
• Application: Semicon Wafer
• Type for Grinding Machine: Special Grinding Machine
• Grinding Machine Type: Barrel Polishing Machine
• Grinding Method: Wet Grind
• Certification: CE
• Condition: New
• Transport Package: Wooden Case
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 1000

Product Description

Small desktop Lapping and Polishing Machine
The wafer polishing process is to smooth and polish the surface of semiconductor wafers to obtain a highly flat and smooth surface, laying the foundation for subsequent chip manufacturing processes. The polishing process of each wafer can remove about 95% of surface defects, and a highly flat wafer surface facilitates the smooth progress of subsequent photolithography and etching processes. Therefore, this also requires grinding and polishing equipment to have high precision and stability, while also considering the characteristics of materials and processing efficiency.
Desktop grinding and polishing machines have a compact design and are suitable for placement in laboratories, research rooms, or small production environments. Due to low pressure processing, these machines are suitable for processes that apply slight pressure to samples or devices, thereby avoiding damage caused by excessive pressure. Its advantage lies in low cost, suitable for budget limited projects, and can be equipped with ventilation cabinets for safety and environmental issues.

1. Small desktop single workstation model, used for high-precision grinding and polishing of wafers and samples.
2. The grinding and polishing disc has a diameter of 400mm and can be used for processing wafers and samples of six inches or less.

Features:
1. Maximum wafer size for grinding and polishing is 6 inches.
2. Swing arm swing amplitude is adjustable from 0 to 15 degrees.
3. Swing arm swing speed is uniformly adjustable.
4. Drip rate is uniformly adjustable from 1 to 100 ml/min.
5. Full LCD screen control.
6. Plate speed is 5-100 rpm.


Dual workstation desktop model, suitable for precision grinding and polishing of 6-inch and below wafers. The diameter of the grinding disc is 400mm.
The precision grinding and polishing machine is a dual workstation model and a desktop computer.

Features:
Compatible with 2 precision fixtures of 6 inches and below for precision grinding and polishing;
Using dual peristaltic pumps for liquid supply and a single drum for stirring to prevent liquid settling;
The swing arm can be configured with a main drive motor function to improve grinding and polishing efficiency;
Touch screen control, program editing and storage;
Vacuum switch control, convenient for fixture operation.

Accessory:

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 


FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.