Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball Bonder

Product Details
Type: CNC
Control Mode: CNC
Voltage: AC220V
Diamond Member Since 2017

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  • Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball Bonder
  • Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball Bonder
  • Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball Bonder
  • Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball Bonder
  • Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball Bonder
  • Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball Bonder
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Basic Info.

Specification
700*460*550mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Products Description
Welding principle:
This machine uses the principle of ultrasonic friction to realize the surface welding of different media, which is a physical
change process.
First, the first end of the gold wire must be processed to form a spherical shape (this machine adopts negative electron high pressure to form a ball), and the welded metal surface is pre-heated
;Then, under the combined action of time and pressure, the gold wire ball produces spontaneous deformation on the metal welding surface, so that the two media can reach reliable contact, and through ultrasonic friction vibration, the two metal atoms are formed under the action of atomic affinity. The metal bond realizes the welding of the gold wire lead.
Gold wire ball bonding is superior to silicon-aluminum wire bonding in terms of electrical properties and environmental
applications. However, since the welding parts made of precious metals must be heated, the application range is relatively narrow.

Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball BonderLaboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball BonderLaboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball BonderApplication
Gold wire ball bonding machine is mainly used for LED, chips, diode, laser tube, the inner lead, semiconductor devices etc.
Sample
Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball BonderLaboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball BonderLaboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball BonderSpecification
 
electric requiement 220VAC±10%,50HZ,be sure connected to ground
wire diameter 17~50μm
ultrasonic power 0-3W, two channel. can be set separately of the two point
bond time 0-200ms,two channel
bond force 35-180g,two channel
digital camera systerm optional
min bonding time 0.4s/wire
span between first bond to second bond by automatic mode more than 4mm
length of terminal wire 0-2mm
ball dimension 2-4 times bigger setable
bond temperature house temperature ~ 400ºC
jig moving area Φ25mm
microscope 15X,30X
dimension 700*460*550mm
weight 28kg
Packing & Delivery
Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball Bonder
Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball Bonder
Company Profile
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
The most competitive 4 types: thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire); Wire wedge bonder
MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department. And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).

Laboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball BonderLaboratory/Research Room/Teaching Equipment/Ultrasound/Manual Wire Bending Machine/Gold Wire Ball BonderFAQ
1. who are we?
We are based in Guangdong, China, start from 2014,sell to North America(00.00%),Western Europe(00.00%),South
Asia(00.00%),Southeast Asia(00.00%),Mid East(00.00%),South America(00.00%),Eastern Asia(00.00%),Northern Europe(00.00%).
There are total about 11-50 people in our office.


2. how can we guarantee quality?
Always a pre-production sample before massproduction; Always final Inspection before shipment;

3.what can you buy from us?
Soldering machine,Precision spot welding machine,Plasma cleaning machine,Glue dispenser,Screw machine

4. why should you buy from us not from other suppliers?
with ultra professional service and skill to provide high performance but competitive price goods, the customer's success is our own success.

5. what services can we provide?
Accepted Delivery Terms: FOB,CIF,EXW,FCA,CPT; Accepted Payment Currency:USD,EUR,HKD,CNY; Accepted Payment Type: T/T,PayPal,Cash; Language Spoken:English,Chinese
 

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