Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process

Product Details
After-sales Service: 1 Year
Function: Wafer Jet
Demoulding: Automatic
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process
  • Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process
  • Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process
  • Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process
  • Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process
  • Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process
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Basic Info.

Model NO.
MDWF-CDA8030(CD)+MDWF-WJ8030
Condition
New
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
>1,000,000 Shots
Transport Package
Wooden Case
Specification
2800*1500*2000mm
Trademark
minder hightech
Origin
China
Production Capacity
1000

Product Description

Water Jet Deflash System
Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process
Solution one: MDWF-CDA8030(CD)+MDWF-WJ8030
Solution two: MDWF-EDWJ8030(ED+WJ)

Application:
Used for deflash after the molding process of semiconductor IC , LED, TO, SOT, QFN, DFN etc…
According product performance and lead frame plating material, choose suitable solutions for deflash.
Normally have two solution.
1, MDWF-CDA8030(Chemical Deflash) + MDWF-WJ8030(wafer jet)
2, MDWF-EDWJ8030(Electrolysis Deflash + Water Jet)
According our experience NiPdAu plating need ED, other no need. final requirement pending on Chip performances. In MDWF-EDWJ8030 which with ED unit can also work when ED unit is selected power off.
Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj ProcessSemiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj ProcessSemiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process
Suitable lead frame (can customize):
length 140-245mm
width 50-80mm
thickness 0.2-3mm

Process:
MDWF-CDA8030(Chemical Deflash) Automatic upload >>chemical immerse>>bubble cleaning(optional ultrasonic cleaning)>>download
MDWF-WJ8030(water jet) Automatic upload>>water jet>>ultrasonic cleaning>>spray drying>>oven drying>>download
MDWF-EDWJ8030(Electrolysis Deflash + Water Jet) Automatic upload>>Electrolysis deflash>>water jet>>ultrasonic cleaning>>spray drying>>oven drying>>download

Character and basic configuration:
Water jet unit: jet nozzle:16pcs diamond nozzle; 1pcs 30HP high pressure pump. automatic pressure adjustment system.
Ultrasonic unit: 600W(1000mm)
Spray drying: 7set air nozzle,7.5kw/set. (1150mm)
Oven drying: 120C degree, (1000mm)

Size:
MDWF-CDA8030(Chemical Deflash): 2800*1500*2000mm customize
MDWF-WJ8030(water jet):4800*1100*1600mm (customize)
MDWF-EDWJ8030(Electrolysis Deflash + Water Jet): 10800*1100*1600mm (customize)


Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj ProcessSemiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 
Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj ProcessSemiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj ProcessSemiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj ProcessSemiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj ProcessSemiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process

Semiconductor IC Assembly Backend Process After Molding Mold Flash Water Jet Deflash Wj Process

Frequently Asked Questions


1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

 

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