The High-Precision Cutting Machine Reduces The Cutting Distance and Can Precisely Cut Silicon Wafers, Gallium Arsenide, Lithium Niobate, Aluminum Oxide, and Cer

• After-sales Service: 1 Year
• Warranty: 1 Year
• Transport Package: Wooden Crate
• Specification: 665mm*850mm*1650mm
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

DS623 - precision dicing machine
    DS623 precision scribing machine is equipped with imported high-power DC spindle; θ-axis imported DD motor drive; imported high-precision lead screw and guide rail, higher movement accuracy; double lens alignment accuracy is higher; software functions are further strengthened, and the degree of automation is significantly improved .

Product parameter

Configuration and performance	Processing size	φ160mm or 150mm
	Groove depth	<=4mm or customized
	Flatness of worktable	±0.005mm/150mm
	Alignment system	Dual lens, straight light+ring light
Spindle	range of rotation	10000~50000rpm
	Output Power	DC 1.5KW (2.4KW optional)
X axis	Drive way	servo motor
	Workbench left and right stroke	240mm
	Stroke resolution	0.001mm
	Speed setting range	0.1~500mm/s
Y axis	Drive way	Stepping motor + grating closed loop control system
	Spindle back and forth stroke	170mm
	Stroke resolution	0.0001mm
	Single-step positioning accuracy	<=0.002mm/5mm
	Full positioning accuracy	<=0.004mm/170mm
Z axis	Drive way	Stepper motor
	Spindle up and down stroke	30mm
	Stroke resolution	0.0001mm
	Repeatability	0.001mm
θ axis	Drive way	DD motor
	Angle range	380º
	Angle resolution	0.0002º
Basic specifications	power supply	Three-phase, AC380±5%, 3.0kVA
	power consumption	0.6KW during processing (reference value)
		When warming up 0.4KW (reference value)
	Compressed air	Pressure 0.5~0.6Mpa, maximum consumption 220L/min
	Cutting water	Pressure 0.2~0.3Mpa, maximum consumption 3.5L/min
	Cooling water	Pressure 0.2~0.3Mpa, maximum consumption 1.5L/min
	Exhaust volume	1.5m³/min(ANR)
	Dimensions W×D×H	580mm×850mm×1650mm
	weight	500kg

Features:
√ Blade database management
√ Workpiece cutting database management
√ Auto focus function
√ Two-way lifting knife cutting function
√ Compensation function for blade exposure
√ Multiple safety guarantees and alarm functions 
Conditions of Use:
1. Please set the machine in an environment of 20~25ºC (the fluctuation range is controlled within ±1ºC); the indoor humidity should be 40%~60%, keep constant without condensation.
2. Please use clean compressed air with atmospheric pressure dew point below -15ºC, residual oil content of 0.1ppm and filtration degree above 0.01um/99.5.
3. Please control the water temperature of the cutting water to room temperature 2ºC (fluctuation range within ±1ºC), and control the cooling water temperature to be the same as room temperature (fluctuation range control within ±1ºC).
4. Please avoid the device from gravitational impact and any external vibration threats. In addition, please do not install the equipment near blowers, vents, devices that generate high temperatures, and devices that generate oil.
5. Please install this equipment on a waterproof floor and a place with drainage treatment.
6. Please operate strictly in accordance with the company's product instruction manual.
Application areas: IC, optical optoelectronics, communications, LED, MEMS, medical equipment
Precision cutting materials: silicon wafer, gallium arsenide, lithium niobate, alumina, ceramics, glass, quartz, sapphire, circuit board
Workpiece shape recognition function:
Accurately identify the contours of irregularly shaped processed objects, which can be cut along the contour shape, reducing empty cutting and increasing productivity.
Accessories Consumables

Brand customers
Well-known company
Colleges and universities
Factory


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