Mems Semiconductor Advanced Packaging Tsv Tgv Optoelectronic Materials Precision Grinding Polishing Equipment

• After-sales Service: 1 Year
• Warranty: 1 Year
• Type: CMP
• Model NO.: MDAM-CMP100 MDAM-CMP150
• Control: CNC
• Automation: Automatic
• Precision: High Precision
• Type for Grinding Machine: Special Grinding Machine
• Grinding Machine Type: Barrel Polishing Machine
• Grinding Method: Wet Grind
• Certification: ISO, CE
• Condition: New
• Transport Package: Wooden Case
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 1000

Product Description

Precision Grinding and Polishing Machine for Semiconductor Materials
Equipment Overview:
The MDAM-CMP100/150 grinding and polishing machine is a precision grinding and polishing equipment that covers applications such as semiconductor materials and optoelectronic materials. Mainly used for grinding and thinning of major semiconductor material chips such as silicon, silicon dioxide, and indium antimonide focal plane chips, as well as chemical mechanical polishing of the bottom, surface, and end faces. The entire equipment and all components are fully anti-corrosion treated, and process parameters can be set through the touch screen interactive interface. Scientific and reasonable design, advanced performance, high degree of automation, convenient operation, convenient maintenance and strong reliability, sample substrate bonding, grinding thinning, chemical mechanical polishing, and the connection between the pre and post detection processes are reasonable, to ensure that the processing dimensions of each function of the equipment are consistent. By configuring different hardware and consumables, multiple machine configurations and process solutions can be achieved to meet various technical requirements such as different materials and sizes of users.
With the rapid development of semiconductor technology, the performance and functional requirements of integrated circuits continue to increase. TSV (Through Silicon Via) and TGV (Through Glass Via) technologies, as advanced packaging and interconnect technologies, can effectively improve the integration and performance of chips. This device has a unique process plan for implementing TSV/TGV technology.

Equipment Advantages:

• Independent and movable touch operating system;
• Implement chip end face grinding and polishing, as well as special angle preparation;
• Can store 100 process menus;

• Endpoint detection EPD function;
• Optional increase to 3-channel feeding system;
• Suitable for sample sizes of 6 inches and below

Equipment Function:
MDAM-CMP100/150 precision grinding and polishing machine, the main unit and all spare parts are made of highly corrosion-resistant materials. The whole machine is corrosion-resistant, stable, wear-resistant, and rust resistant, suitable for chemical mechanical grinding and polishing of various semiconductor materials. The workspace is separated from the display control area and is digitally controlled using a touch screen control system. It is CNC controlled, storable, and retrievable.
The device system has a timing function, which can work continuously for 10 hours and control the speed of the polishing disc. The control panel is placed outside the work area to prevent abrasive solution from splashing onto the control panel. All parameters of the host can be adjusted on the touch screen. The host process parameters have storage and retrieval functions to ensure consistency and repeatability of the process. The wafer sample is adsorbed on the bottom surface of the fixture by vacuum pumping, equipped with an oil-free vacuum pump, and has independent anti reverse suction function.
The fixture configuration sample horizontal rotation drive system has a swing function, with a swing range of 0-100% adjustable. The swing amplitude and frequency speed can be accurately set through the control panel. The fixture is equipped with an independent drive system for rotation, with an adjustable speed range of 0-120rpm. This functional design ensures full swing polishing of the sample during the grinding and polishing process, greatly improving the polishing capacity and efficiency of the equipment.
The fixture is equipped with a digital thickness monitoring table with a monitoring accuracy of 1 μ m. The pressure of the fixture on the wafer sample is continuously adjustable, with a pressure range of 0-3.5kg and an accuracy of 2g/cm ², and equipped with a pressure measuring device.
The operation of the grinding and polishing disc is controlled by the main drive, and the disc speed can be adjusted from 0 to 120 revolutions per minute. This speed variation range effectively ensures the speed of grinding and polishing samples of different hardness and size materials, thereby achieving higher process indicators. The replacement of grinding discs and polishing discs is simple and fast, with embedded discs that enable the equipment to quickly transition from grinding to polishing processes, greatly reducing process time. And the grinding disc is equipped with a disc repair block to ensure that the grinding disc has good flatness.


Precision Grinding and Polishing System:
This device integrates advanced technology equipment, and its unique design enables rapid and seamless switching between grinding and polishing processes, ensuring both processing efficiency and dual improvement in processing accuracy and surface quality.
This grinding and polishing equipment achieves high-precision polishing of complex shaped samples and fiber end faces. Similarly, it processes end faces, crystals, and samples with special morphologies of lithium niobate materials. Fixture accessories can be customized according to the sample situation to achieve surface grinding and polishing of samples with different morphologies. Whether it's angle polishing, flat polishing, or special surface treatment, it can all demonstrate excellent professional performance and processing flexibility.
 

Model	MDAM-CMP100	MDAM-CMP150
Wafer size	4 inches and below	6 inches and below
Working plate diameter	420mm	420mm
Station	≤4	≤2
Feed port	≤3
Power supply	220V,10A
Timing	0-10h
Ambient temperature	20ºC~35ºC
Plate speed	0-120rpm
Fixture rate	0-120rpm

 

Sample fixing system component	Clamp, roller arm
Lapping process assembly	Lapping plate, plate repairing block, and cylinder
Polishing process assembly	Polishing fluid feeding system and polishing plate
Detection component	Test benchmark platform,flatness tester,pressure test gauge
Wafer lapping and polishing material package	Lapping powder,polishing solution,polishing cloth,wax, dewaxing fluid,glass substrate sheet

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 


FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.