Semiconductor Equipment Wafer Die Attach Dicing Saw Preparation Wafer Mounting Machine High-Precision Vacuum Wafer Mounter

Product Details
After-sales Service: 1 Year
Condition: New
Speed: High Speed
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Year of Establishment
2014-12-30
Registered Capital
147802.18 USD
  • Semiconductor Equipment Wafer Die Attach Dicing Saw Preparation Wafer Mounting Machine High-Precision Vacuum Wafer Mounter
  • Semiconductor Equipment Wafer Die Attach Dicing Saw Preparation Wafer Mounting Machine High-Precision Vacuum Wafer Mounter
  • Semiconductor Equipment Wafer Die Attach Dicing Saw Preparation Wafer Mounting Machine High-Precision Vacuum Wafer Mounter
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Basic Info.

Model NO.
MDXT-VWM8
Precision
High Precision
Certification
ISO, CE
Warranty
12 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Transport Package
Wooden Case
Trademark
minder-hightech
Origin
China
Production Capacity
1000

Product Description

MDXT-VWM8
Automatic High-precision Vacuum Wafer Mounter
Semiconductor Equipment Wafer Die Attach Dicing Saw Preparation Wafer Mounting Machine High-Precision Vacuum Wafer MounterSemiconductor Equipment Wafer Die Attach Dicing Saw Preparation Wafer Mounting Machine High-Precision Vacuum Wafer MounterSemiconductor Equipment Wafer Die Attach Dicing Saw Preparation Wafer Mounting Machine High-Precision Vacuum Wafer Mounter
Equipment Features
1. Vacuum mounting without rollers
2. Automatic film feeding
3. Automatic vacuum mounting
4. Automatic cutting, waste film collection, and isolation paper collection
5. Equipped with light curtain protection function
6. Equipped with emergency stop button
7. Manual loading and unloading is only required

Equipment performance
1. Wafer yield: ≥99.9%
2. Film quality: no bubbles (excluding dust particles)
3. Hourly production capacity: ≥40 wafers
4. MTBF: >500 hours
5. MTTR: <1 hour
6. Downtime: <3%
7. Product replacement time: ≤10 minutes
 
Wafer size 4"~ 8" wafer
Wafer thickness 100~750 microns
Wafer type Si, SiC, GaN, or other materials
Film type Blue film, UV film
Width: 230 ~ 300 mm
Length: 100 m
Thickness: 0.05 ~ 0.2 mm
Wafer carrier ring 6",8"DISCO
Loading and unloading method Manual wafer/carrier ring placement and removal
Film positioning accuracy ±0.5mm
Standard 6" and 8" wafer plates for 6" and 8" wafers
Vacuum pump Minder-Hightech
Antistatic control Deionization fan
Control unit Based on PLC control, with 10" touch screen
Safety protection Configured with light curtain protection and emergency stop button
Power supply voltage Single-phase AC 220V, 16A
Compressed air 0.45~0.6MPa, flow rate 70L/min
Machine housing White plastic-sprayed metal housing
Volume 850mm (width)*1750mm (depth)*1970mm (height)
Net weight 480kg

Since 2014,
One-stop Professional Solution for Semiconductor and Electronic product industry equipments. 
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FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
 

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