Semiconductor Device Fabrication Fab Wafer Fabrication Feol Substrate CMP Cyctem for Lapping

• After-sales Service: 1 Year
• Warranty: 1 Year
• Certification: CE
• Model NO.: MDS8104LMFR
• Condition: New
• Number of Station: 4
• Facing & Grooving Speed Not Include in P: 0-120mm/M
• Total Weight: 2200kg
• Floor Space: 2200*1200mm
• Cylinder Bar Rotate Speed: 0-40 Rpm
• Transport Package: Sea
• Specification: 2000KG
• Trademark: MINDERHIGHTECH
• Origin: Guangzhou
• HS Code: 8501109101

Product Description

MDS8104LMFR/MDS8104PMFR

SEMIAUTO SUBSTRATE LAPPING/POLISHING MACHINE

Machine Application

Process Type

Sort by Process Material

Sort by Application

SINGLE SIDE
PLATE
LAPPING &
POLISHING

Metal & Alloy
Ceramic
Oxide
Carbide
Glass
Plastic

Semi Conductor

LED substrate
Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc.

Resin

PE,E/VAC,SBS,SBR,NBR,SR,BR,PR

PCB

,, adhensive,coating,circuit

Optical

,,,HUDoptical lens,HUD glass, screen glass

Radar
Gemstaone
Others

Oxide coating plate
Jade,sapphire,agate etc
Valve sealing ring. Micrometer Diamond,bearing,etc

Lapping can only remove slight thickness of object.if thining margin>=100um, thinner machine are needed.(contact us for thinner)

Machine Specification

Machine Class

Standard Specification

Machine Series

MDS8104LMFR

Plate diameter

Φ810mm

Max. Object Diameter

Φ350 mm

Number of station

4

Plate Rotate Speed

0-90 RPM

Cylinder Bar Rotate Speed

0-40 RPM

Facing & Grooving Speed
Not include in Polishing

0-120mm/m

Total weight

2200kg

Floor space

2200*1200mm

Optional Choice

Specification

Controls

Digital  /  Touch-screen PLC

Pressure Source

Integrated with PLC

Facing & Grooving system

Digital  /  Manual control feeding depth integrated with PLC  /   
PLC control feeding depth integrated with PLC

Plate cooling system

Integrated in Machine

Slurry supply system

Digital  /  integrated with PLC

Cylinder Bar Drive System

Integrated with PLC

Dust Vacuum system

Manual  /  Integrated with PLC

1,Sample making based on production requirement can confirm the necessity of optional kits.
2,The shaded options is buit in this machine.
3,Facing and Grooving system is unnecessary for polishing machine and not configured.
4,Substrate Lapping/Polishing machine is highly configured, A dust-proof shelter is utilized for protection from fugitive or solid particle scraping against object's surface while processing, especially when polishing.
5,Contact us for more type of lapping/polishing machine



 

Samples

Sample Record

Application & Material

 

MDS8104LMFR/MDS8104PMFR

SEMIAUTO SUBSTRATE LAPPING/POLISHING MACHINE

Machine Application

Process Type

Sort by Process Material

Sort by Application

SINGLE SIDE PLATE LAPPING & POLISHING

Metal & Alloy Ceramic Oxide Carbide Glass Plastic

Semi Conductor

LED substrate Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, InP, ZnO, AlN, Al2O3, etc.

Resin

PE,E/VAC,SBS,SBR,NBR,SR,BR,PR

PCB

,, adhensive,coating,circuit

Optical

,,HUDoptical lens,HUD glass, screen glass

Radar Gemstaone Others

Oxide coating plate Jade,sapphire,agate etc Valve sealing ring. Micrometer Diamond,bearing,etc

Lapping can only remove slight thickness of object.if thining margin>=100um, thinner machine are needed.(contact us for thinner)

Machine Specification

Machine Class

() Flat Lapping Machine

() Double Disc Lapping Machine

Brush Polishing Machine

Substrate Grinding/Thinning Machine

Standard Specification

Machine Series

MDS8104LMFR

Plate diameter

Φ810mm

Max. Object Diameter

Φ350 mm

Number of station

4

Plate Rotate Speed

0-90 RPM

Cylinder Bar Rotate Speed

0-40 RPM

Facing & Grooving Speed Not include in Polishing

0-120mm/m

Total weight

2200kg

Floor space

2200*1200mm

Optional Choice

Specification

Controls

Digital  /  Touch-screen PLC

Pressure Source

Integrated with PLC

Facing & Grooving system

Digital  /  Manual control feeding depth integrated with PLC  /    PLC control feeding depth integrated with PLC

Plate cooling system

Integrated in Machine

Slurry supply system

Digital  /  integrated with PLC

Cylinder Bar Drive System

Integrated with PLC

Dust Vacuum system

Manual  /  Integrated with PLC

1,Sample making based on production requirement can confirm the necessity of optional kits. 2,The shaded options is buit in this machine. 3,Facing and Grooving system is unnecessary for polishing machine and not configured. 4,Substrate Lapping/Polishing machine is highly configured, A dust-proof shelter is utilized for protection from fugitive or solid particle scraping against object's surface while processing, especially when polishing. 5,Contact us for more type of lapping/polishing machine

Samples

Sample Record

Application & Material

Diagonal Diameter

Process Type

Flatness

Roughness

Parallel

Thickness

Note

Industrial Sapphire

various

Lapping Polishing

2μm

≤Ra 0.02 μm

5μm ±1μm

0.2mm

N

Solar Wafer

Various

Lapping

1μm

Not Required

2μm ±1μm

0.15mm

N

Substrate CaC2

Φ22mm

Lapping

0.5μm

Not Required

1μm ±0.5μm

0.05mm

N

Wafer Si

Various

Lapping Polishing

2μm

≤Ra 0.02 μm

3μm ±1μm

0.1mm

N

LED substrate copper

Φ169mm

Lapping Polishing

5μm

≤Ra 0.01 μm

5μm ±1μm

Not required

N

Substrate MgO

Φ72mm

Lapping

1μm

Not Required

1μm

0.1mm

N

Substrate Al2O3

Φ158mm

Lapping Polishing

3um

≤Ra 0.02 μm

3um ±1μm

0.13mm

N

onal Diameter

Process
Type

Flatness

Roughness

Parallel

Thickness

Note

Industrial Sapphire

 

various

Lapping
Polishing

2μm

≤Ra 0.02 μm

5μm
±1μm

0.2mm

N

Solar Wafer

Various

Lapping

1μm

Not Required

2μm
±1μm

0.15mm

N

Substrate
CaC₂

Φ22mm

Lapping

0.5μm

Not Required

1μm
±0.5μm

0.05mm

N

Wafer
Si

Various

Lapping
Polishing

2μm

≤Ra 0.02 μm

3μm
±1μm

0.1mm

N

LED substrate copper

Φ169mm

Lapping
Polishing

5μm

≤Ra 0.01 μm

5μm
±1μm

Not required

N

Substrate
MgO

Φ72mm

Lapping

1μm

Not Required

1μm

0.1mm

N

Substrate
Al₂O₃

Φ158mm

Lapping
Polishing

3um

≤Ra 0.02 μm

3um
±1μm

0.13mm

N