LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Type: Pull Tester
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester
  • LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester
  • LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester
  • LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester
  • LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester
  • LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester
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Basic Info.

Model NO.
MD-BT104
Display
Digital
Brand
Minder-Hightech
Applicable Industry
Electronics
Species
Dual Rocker Four Way Operation
Spring Dynamometer Species
Data Acquisition System
Structure
Automatic
Customized
Customized
Equipment Weight
95kg
Specification
680*580*710mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Product Display
MD-BT104
LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester
 application area
Semiconductor packaging
TO series packaging
LED packaging
IGBT packaging
Microelectronic packaging
MD-BT104 The multifunctional push-pull testing machine is widely used in applications such as LED packaging testing, IC semiconductor packaging testing, TO packaging testing, IGBT power module packaging testing, optoelectronic component packaging testing, automotive, aerospace, product testing, research institutions' testing, and various universities' testing and research
Equipment Function Introduction The overall structure of the equipment adopts a five axis positioning control system, with X-axis and Y-axis travel of 100mm and Z-axis travel of 80mm. Combined with the unique design of ergonomics and comprehensive protection measures, the left and right Hall rockers control the free movement of the XYZ platform, making operation simpler, more convenient, and more user-friendly.
The sturdy body design can reach up to 200KG, with a maximum testing force of 100KG for the Y-axis and 20KG for the Z-axis.
The intelligent workstation automatic replacement system reduces the complexity of manually replacing modules, while also improving the efficiency and convenience of testing.
High precision dynamic sensing combined with unique mechanical algorithms enables each sensor to adapt to precise testing in different environments and ensure the accuracy of testing accuracy.
LED intelligent lighting control system, when the equipment is idle, the lighting lights automatically turn off, and when personnel operate, the LED lighting lights turn on.
Device Software Chinese and English software interface, three-level operation permissions, and all levels of operation permissions can be freely set
Force units Ka, g, N, can be selected according to testing needs
The software can output real-time histograms and force curves of test results, and has the function of saving and exporting test data in real time. The test data can also be connected to the MES system in real time.
The software can set standard values and directly output test results, automatically judging the test results.
SPC data export comes with maximum, minimum, average, and CPK calculations for the current exported data
Sensor accuracy Sensor accuracy ± 0.003%: comprehensive testing accuracy ± 0.25%.
Testing accuracy
 
Test sensor range automatic switching.
Multiple point linear accuracy correction and repeatability testing using standard method codes to ensure the accuracy of sensor test data
Software parameter settings According to the permissions at all levels, parameters such as qualified force value, shear height, and testing speed can be adjusted.
Testing Platform The vacuum 360 degree free rotation testing platform is suitable for various material testing needs, and can easily meet the testing needs of various materials by replacing the corresponding fixtures or pressure plates.
Test Page
LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond TesterLED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond TesterLED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester

Testing Parameters
Equipment model MD-BT104
External dimensions 680*580*710(Including left and right rocker rods)
Equipment weight 95KG
Power supply 110V/220V  @4.0A  50/60HZ
compressed air 4.5-6Bar
Vacuum output 500mm Hg
Control computer Lenovo PC
Software operation Windows7/Windows10
microscope Standard binocular continuous zoom microscope (optional three eye microscope)
Sensor replacement method Automatic switching
Platform fixture 360 degree rotation, platform can share various testing fixtures
XY-axis effective stroke 100*100mm
Z-axis effective stroke 80mm
XY axis resolution ±1um Z-axis resolution±1um
Sensor accuracy Sensor accuracy ± 0.003%; Comprehensive testing accuracy ± 0.25%.
   
   
LED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond TesterLED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond TesterLED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond TesterLED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond TesterLED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond TesterLED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond TesterLED Chip Push and Pull Machine Microelectronic Packaging Push and Pull Tester Machine Golden Ball Semiconductor Push and Pull Tester Machine Bond Tester

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