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MD-Jc360-D Syringe Type Die Bonder /Die Bonding Machine / Die Attach for IC Package / Semiconductor
Reference FOB Price
Get Latest Price
US $25,000.00-50,000.00
/ Piece
|
1 Piece
(Min. Order)
After-sales Service:
1 Year
Condition:
New
Speed:
High Speed
Precision:
Precision
Certification:
CE
Warranty:
12 Months
Samples:
US$ 100/Piece
1 Piece(Min.Order)
|
Request Sample
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Guangzhou Minder-Hightech co.,Ltd
Diamond Member
Since 2017
Suppliers with verified business licenses
Audited Supplier
Product Description
Company Info.
Basic Info.
Model NO.
MD-JC360-D
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Trademark
minder-hightech
Origin
China
Production Capacity
100
Product Description
MD-JC360-D Syringe type die bonder
MD-JC360: 8inch/12inch wafer die bonder manual upload and dowload.
Detail:
Factory:
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MD-Jc360-D Syringe Type Die Bonder /Die Bonding Machine / Die Attach for IC Package / Semiconductor
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Guangzhou Minder-Hightech co.,Ltd
Diamond Member
Since 2017
Suppliers with verified business licenses
Audited Supplier
Registered Capital
1000000 RMB