Flip Chip Die Attach Packaging Machine Chip Mounter Equipped with Die Attach Systemhigh Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Model NO.: MH
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Transport Package: Wooden Crate
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

Since 2014,One-stop Professional Solution for 
Semiconductor Front-end and IC TO Package Equipments Line


Automatic die bonder for Semiconductor industry IC package 

MD-JC360-D  MD-JC380-D   MD-JC360  MD-JC380  MD-JC360i    MD-JC380i   MDAX64DI      MD-1412

Automatic loading and unloading die bonder

Fully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support products;

Modular design, new optimized layout, focus on quality, with the best stable performance;

You can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customers;

Brand-new tying head design, fast die bond cycle up to 180ms;

Patented head binding, accurate positioning and more stable operation;
5mil small chip processing capacity
Design a variety of chip search methods, suitable for the search of various shapes of wafers
Ultra-long PIN (65ms) processing capability to meet different customer needs.

Bonding arm
Bonding arm	90 degree
Motor	AC servo moto
Wafer work stage
Stroke	6"*6"
resolution	0.2 mil (5μm)
Lead frame wore stage
Lead frame number	1PC
Stroke	10"*6"
Resolution	0.2 mil (5μm)
Die and wafer
Die dimension	5mil*5mil~100mil*100mil
Wafer dimension	6
	:±3°
	:±1.5mil
	25g~35g
Ejector system
Sync with the part
Can adjust the height
Epoxy picking system
Epoxy picking arm	Rotary type
moto	AC servo moto

Image recognition system
Method	256 gray
Resolution	1024*768
Optical rate	0.7~4.5x
Accuracy	1.56 μm~8.93 μm
speed
Bonding cycle	180ms
Program storage
Program storage	100
Maximum number of chips per carrier	1024
Number of single carrier boards	1
Die lost checking system
Method	Vacuum sensor
Requirement
Voltage	AC 220V/50 HZ
Compressed air	≥0.6MPa,70L/min
Vacuum	600mmHg
Maximum power	1800W
Weight	680KG
dimension	1310*1265*1777mm

Equipment real shoot




We have 16 years of experience in equipment sales ,
and can provide you with a one-stop IC Package Line Equipment solution!

Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.