Semiconductor Industry High Speed Automatic Die Attach Die Attachment Equipment Die Bonder Die Bonding Machine IC to Package Machine

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Model NO.: MD-1412
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Transport Package: Wooden Crate
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

Since 2014,One-stop Professional Solution for 
Semiconductor Front-end and IC TO Package Equipments Line

High precision die bonder MD-1412

This die bonder is high precision die bonder use for high requirment die bonding, it first picking die by swing to a holder, which can calibrate the angle, and then re-pick to the leadframe by linear guide.
 

Description	MD-1412 Die Bonder Machine
UPH	5 ~ 6K(swing arm and linear motion)
Placement accuracy	±25um
Die rotation	+/- 2°
Die size	6553 Sensor die:2.12*212mm 6100 Sensor die:1.65*1.65mm 3224 Asic die:1.20*1.27mm I-Lite Asic die:1.96*1.51mm
Bondline thickness control	Yes,Pressure control mode
Substrate size
Length	76(Can be customized according to customer requirements)
Width	101(Can be customized according to customer requirements)
Thickness	(Can be customized according to customer requirements)
Wafer system
Standard	Contains 12-inch wafer ring mechanism and chip box clamping mechanism; thimble assembly; XY table;10 inch, 12 inch, 14 inch metal frame fixture, manual adjustment; Standard dispensing needle adhesive dispensing
	6"wafer size [ 10" metal frame ] 8"wafer size [ 12" metal frame ] 12"wafer size [ 14" metal frame ]
Facilities required
Voltage	220 VAC
Full load current	NA
Frequency	50Hz
Power consumption	600 ~ 1000W
Compressed air	Min 6 bar [ 87psi ]
Dimension & Weight
W x D x H	2000mm x 1200mm x 1800mm
Weight	1700kg

Detail:

Factory:

Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.