| After-sales Service: | 1 Year |
|---|---|
| Condition: | New |
| Speed: | High Speed |
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High precision die bonder MD-1412
This die bonder is high precision die bonder use for high requirment die bonding, it first picking die by swing to a holder, which can calibrate the angle, and then re-pick to the leadframe by linear guide.
| Description | MD-1412 Die Bonder Machine |
| UPH | 5 ~ 6K(swing arm and linear motion) |
| Placement accuracy | ±25um |
| Die rotation | +/- 2° |
| Die size | 6553 Sensor die:2.12*212mm 6100 Sensor die:1.65*1.65mm 3224 Asic die:1.20*1.27mm I-Lite Asic die:1.96*1.51mm |
| Bondline thickness control | Yes,Pressure control mode |
| Substrate size | |
| Length | 76(Can be customized according to customer requirements) |
| Width | 101(Can be customized according to customer requirements) |
| Thickness | (Can be customized according to customer requirements) |
| Wafer system | |
| Standard | Contains 12-inch wafer ring mechanism
and chip box clamping mechanism; thimble assembly; XY table;10 inch, 12 inch, 14 inch metal frame fixture, manual adjustment; Standard dispensing needle adhesive dispensing |
| 6"wafer size [ 10" metal frame ] 8"wafer size [ 12" metal frame ] 12"wafer size [ 14" metal frame ] |
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| Facilities required | |
| Voltage | 220 VAC |
| Full load current | NA |
| Frequency | 50Hz |
| Power consumption | 600 ~ 1000W |
| Compressed air | Min 6 bar [ 87psi ] |
| Dimension & Weight | |
| W x D x H | 2000mm x 1200mm x 1800mm |
| Weight | 1700kg |
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