• Semiconductor Mdves400 Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven Contact Soldering with Vacuum
  • Semiconductor Mdves400 Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven Contact Soldering with Vacuum
  • Semiconductor Mdves400 Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven Contact Soldering with Vacuum
  • Semiconductor Mdves400 Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven Contact Soldering with Vacuum
  • Semiconductor Mdves400 Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven Contact Soldering with Vacuum
  • Semiconductor Mdves400 Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven Contact Soldering with Vacuum

Semiconductor Mdves400 Single Cavity Vacuum Reflow Oven for Solder IGBT Mems Vacuum Soldering Oven Contact Soldering with Vacuum

Basic Frame: 1260*1160*1200mm
Maximum Height of Base: 90mm
Observation Window: Include
Weight: 350kg
Vacuum Level: up to 10PA
Process Gas: N2, N2 / H2 (95% / 5%), HCOOH
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  • Overview
  • Product Description
  • Application
  • Product features
  • Product Parameters
Overview

Basic Info.

Model NO.
MDVES400
Trademark
minder-hightech
Origin
China

Product Description

Product Description

The design basis of the MDVES400 vacuum sintering furnace is vacuum and water cooling control, which can not only ensure the void rate, but also increase the cooling rate.
The standard gas of MDVES200 includes: nitrogen, nitrogen-hydrogen mixed gas (95%/5%) and formic acid. The customer selects the corresponding gas as the process gas according to his actual situation, and does not need to worry about the additional configuration. The PLC control system of the equipment can well monitor the operations of vacuum pumping, inflation, heating control, and water cooling to ensure the stability of the customer's process.
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Application

IGBT modules, TR components, MCM, hybrid circuit packages, discrete device packages, sensor/MEMS packages (water-cooled), high-power device packages, optoelectronic device packages, air-tight packages (water-cooled), eutectic bump welding, etc.
 

Product features

1. MDVES400 is a cost-effective product with a small footprint and complete functions, which can meet customer R&D and initial production use;
2. The standard configuration of formic acid, nitrogen and nitrogen-hydrogen gas can meet the gas demand of various products of customers, without the trouble of adding process gas pipeline for the follow-up;
3. Adopting water cooling control can increase the cooling rate, so that the production rate can be increased and the production can be maximized; 4. When the customer relates to the vacuum sealing of the tube shell, the water cooling design will highlight the advantages and avoid the air cooling caused by the tube sheet and The puncture problem of the tube shell;
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Product Parameters

 

 

structure size
Basic frame 1260*1160*1200mm
Maximum height of base 90mm
Observation window include
Weight 350KG
Vacuum system
Vacuum pump Vacuum pump with oil pollution filtering device optional dry pump
Vacuum level Up to 10Pa
Vacuum configuration 1. Vacuum pump
2. Electric valve
Pumping speed control The pumping speed of the vacuum pump can be set by the host computer software
Pneumatic system
Process gas N2, N2 / H2 (95% / 5%), HCOOH
First gas path Nitrogen/nitrogen-hydrogen mixture (95%/5%)
Second gas path HCOOH
Heating and cooling system
Heating method Radiant heating, contact conduction, heating rate 150ºC/min
Cooling method Contact cooling, the maximum cooling rate is 120ºC/min
Hot plate material copper alloy, thermal conductivity: 200W/m·ºC
Heating size 420*320mm
Heating device Heating device: the vacuum heating tube is used; the temperature is collected by the Siemens PLC module, and the PID control is controlled by the host computer Advantech.
Temperature range Max 450ºC
Power requirements 380V, 50/60HZ three-phase, maximum 40A
Control System Siemens PLC + IPC
Equipment power
Coolant Antifreeze or distilled water
20ºC
Pressure: 0.2~0.4Mpa
coolant flow rate >100L/min
Water tank water capacity 60L
Inlet water temperature 20ºC
Air source 0.4MPaair pressure0.7MPa
Power supply single-phase three-wire system 220V, 50Hz
Voltage fluctuation range single phase 200~230V
Frequency fluctuation range 50HZ±1HZ
Equipment power consumption about 18KW; grounding resistance 4Ω;



 

Host system including vacuum chamber,main frame, control hardware and software
Nitrogen pipeline Nitrogen or nitrogen/hydrogen mixture can be used as process gas
Formic acid pipeline Bringing formic acid into the process chamber via nitrogen
Water cooling pipeline cooling the upper cover, lower cavity and heating plate
Water cooler Provide continuous water cooling supply to equipment
Vacuum pump Vacuum pump system with oil mist filtration



 

Temperature 10~35ºC
Relative humidity ≤75%
The environment around the equipment is clean and tidy, the air is clean, and there should be no dust or gas that can cause corrosion of electrical appliances and other metal surfaces or cause conduction between metals.




 

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