Semiconductor Packaging Solution Equipment Photoresist Removal New Generation Wafer Surface Activation Microwave Plasma Cleaner Plasma Cleaning Machine

• After-sales Service: 1 Year
• Function: Abrasion Resistance
• Demoulding: Plasma Cleaner
• Model NO.: MH
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Transport Package: Minder-Hightech
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

Microwave Plasma Cleaning Machine
 

For semiconductor chip bonding pre-processing, plastic packaging pre-processing, photoresist removal, metal bonding and pre-processing.

Product introduction:
This is a low voltage microwave plasma cleaning system for semiconductors. By applying microwave with the frequency of 2.45GHz to the window on the wall of the vacuum cavity, a large number of continuous Plasma is generated, and the chip is cleaned by entering the cavity.


Advantages:
1. Plasma is uncharged and will not cause damage to circuits
2. Keep the temperature low during the treatment process
3. Fast response speed and short reaction time
4. No electrodes, no pollution sources, long life
5. Able to maintain plasma under high pressure
6. Microwave junctions and magnetic circuits are compatible
7. Low self-bias voltage requirements
8. The high voltage source and generator are isolated from each other for safety

Application areas:

Dual power supply technology Microwave+Bias RF:
Microwave achieves excellent stripping rate and uniformity (photoresist stripping) characteristics, radio frequency bias provides directional kinetic energy for plasma movement, and dual power supply technology improves the efficiency and effect of semiconductor stripping and etching.

Technical parameters:

Vacuum plasma host
Equipment size	1230X1800X1100mm (width x height x depth)
Weight	450kg
Power demand	AC380V, 50/60Hz, 5-wire, 30A
Plasma generator specifications
Microwave power supply	Power	0~1250W
	Frequency	2.45GHz
Vacuum system
Material	Aluminum alloy (customizable stainless steel chamber)
Thickness	25mm
Internal dimensions of the cavity	480mmX470mmX480mm
Workspaces	6 magazine sections
ECR	Slotted Magazine provides ECR enhanced processing effect
Plasma capability
Processing ability	35um Pitch 40μm Bump 15X15mm Maximum Die size

Equipment details:

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 


Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.