INNER CIRCLE SLICER
Details
Inner circle fully automatic slicing machine is using inside circle to cut a variety of semiconductors, crystal, ceramic, NdFeB magnetic material.
Installed in the spindle, the edge-type Diamond blade cutter is high-speed rotating, the table was feeding by computer control of horizontal and vertical movement, the material on the fixture of the table was cut into the required product.
We have the semi-automatic/fully automatic inner circle clicking machine, within a circle slicer two kinds of specifications, a variety of models.
For the Automatic Slicer inner circle. a worker can operate about 16 units slicer at the same time.
MD-IDC6080
Main technical parameters
Max machining size(mm):φ60 ×80 mm
Cutting speed (cm²/mm):3-6(cm²/mm)
Degree of balance sheets by cutting deviation(mm):±0.005mm
Cutting film thickness(mm):≥0.30
The thin-cut tolerance (mm):±0.015mm
Horizontal stroke(mm):120mm
Longitudinal travel(mm):100mm
Longitudinal degrees:0-100Grid, each grid To 0.01,Each turn a lap in order to1mm
Spindle Electrical:3 Phase 380V 0.75kw
Spindle Speed (r/min):3500Rev / min
Adjust the amount of work table:
Horizontal angle:±45º
Pitch angle of elevation:±10º
Vertically(mm):24
Cooling tank capacity(kg):50kg
Cooling tank motor: 3 Phase 380V 0.12kw 2780r/min
Power:Three-phase four-wire 50Hz 380V
Dimensions(mm):1000 ×1100 ×1600
Weight(kg):~1000(kg)
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