MD-PT3018 Bond Pull Tester Wire Wedge Bonder

• Type: CNC
• Control Mode: CNC
• Voltage: AC220V
• Specification: 350mm*400mm*500mm
• Trademark: minder-hightech
• Origin: Guangzhou
• Model NO.: MD-PT3018
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Products Description
Welding principle:
This machine uses the principle of ultrasonic friction to realize the surface welding of different media, which is a physical
change process.
First, the first end of the gold wire must be processed to form a spherical shape (this machine adopts negative electron high pressure to form a ball), and the welded metal surface is pre-heated;Then, under the combined action of time and pressure, the gold wire ball produces spontaneous deformation on the metal welding surface, so that the two media can reach reliable contact, and through ultrasonic friction vibration, the two metal atoms are formed under the action of atomic affinity. The metal bond realizes the welding of the gold wire lead.
Gold wire ball bonding is superior to silicon-aluminum wire bonding in terms of electrical properties and environmental
applications. However, since the welding parts made of precious metals must be heated, the application range is relatively narrow.
Introduction:
This pull tester is designed for testing the pull strength of the wire and the push strength of the gold ball on the chip and the die bonding strength(COB).
Specification:
Dimension:350mm*400mm*500mm
Power in:220V
Power:5W
Microscope:15/30X OR 20/40X
Push strength range:0-5000G(accuracy: 0.001KG)Meter brand:SP
Pull strength range:0-30G(accuracy:1G)Meter brand:DESK
Jig:depend on product(standard jig: COB, DIP,SMD,High power LED)
Precision lead screw:stroke:200MM
Micrometer:0-25MM(2 pcs)
Precision slide:4PCS
Weight:30kg

Operation:
1,put the product to the jig;
2,adjust the meters to zero;
3, under the microscope, turn the hand wheel slowly, so to push the product to close to the meters;
4, align the probe or hook on the meter to the gold ball or wire.
5, turn the micrometer slowly, the meter can get a value of the strength. be careful of the strength range of the meter!

Application
Gold wire ball bonding machine is mainly used for LED, chips, diode, laser tube, the inner lead, semiconductor devices etc.
Sample

  Packing & Delivery

Company Profile
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
The most competitive 4 types:
thin aluminum wire wedge bonder MDB-2575(25-75um aluminum wire);
Wire wedge bonder MDB-25125(25-125um aluminum wire);
heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);
gold wire ball bonder MDBB-1750(17-50um gold wire).
they are very popular for small quantity production, school, institution, research department. And the 3 automatic: automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).
FAQ
1. who are we?
We are based in Guangdong, China, start from 2014,sell to North America(00.00%),Western Europe(00.00%),South
Asia(00.00%),Southeast Asia(00.00%),Mid East(00.00%),South America(00.00%),Eastern Asia(00.00%),Northern Europe(00.00%).There are total about 11-50 people in our office.

2. how can we guarantee quality?
Always a pre-production sample before massproduction; Always final Inspection before shipment;

3.what can you buy from us?
Soldering machine,Precision spot welding machine,Plasma cleaning machine,Glue dispenser,Screw machine

4. why should you buy from us not from other suppliers?
with ultra professional service and skill to provide high performance but competitive price goods, the customer's success is our own success.

5. what services can we provide?
Accepted Delivery Terms: FOB,CIF,EXW,FCA,CPT; Accepted Payment Currency:USD,EUR,HKD,CNY; Accepted Payment Type: T/T,PayPal,Cash; Language Spoken:English,Chinese