Semiconductor Automatic Dispensing and Die Mounting Machine Multiple Suction Nozzles Chip for Microwave Hybrid Integrated Circuit Photoelectricity

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Model NO.: MD
• Precision: High Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Transport Package: Wooden Case
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 1000

Product Description

Fully automatic high-precision Dispensing Machine and Die bonding machine
The fully automatic high-precision Dispensing Machine and Die bonding machine are key equipment for post packaging that can be combined online, with a positioning accuracy of+/-3um.
The machine adopts advanced motion control technology and modular design concept, with flexible and diverse configuration methods, suitable for multi chip bonding, providing flexible and fast solutions for microwave and millimeter wave fields, hybrid integrated circuit fields, discrete device fields, optoelectronics and other fields.



Function:
1. Programming is convenient, easy to learn, and effectively shortens the training cycle for personnel
2. For white ceramics, substrates with grooves, etc., the one-time success rate of image recognition is high, reducing manual intervention
3. 12 suction nozzles and 24 gel boxes can meet the mounting requirements of most microwave multi chip users
4. Real time monitoring of the current device's working status, material situation, nozzle application, etc. through the second display;
5. Automatic dispensing, automatic SMT station, free combination, multiple cascading machines, effectively improving production;
6. Multi program combination mode, which can quickly call existing subroutines
7. High precision exploration can reach 1um
8. Equipped with precision dispensing control and calibration device, the minimum glue point diameter can reach 0.2mm
9. Efficient mounting speed, with a production capacity of over 1500 components per hour (taking 0.5 * 0.5mm size as an example)

Sample:

For patch platform:

NO.	Component name	Index name	Detailed indicator description
1	Motion platform	Movement stroke	XYZ-250mm*320mm*50mm
		Size of products that can be mounted	XYZ-200mm*170mm*50mm
		Displacement resolution	XYZ-0.05um
		Repeat positioning accuracy	XY axis: ±2um@3S Z axis: ±0.3um
		Maximum running speed of XY axis	XYZ=1m/s
		Limit function	Electronic soft limit + physical limit
		Rotation range of rotation axis θ	±360°
		Rotation resolution of rotation axis θ	0.001°
		Probing height method and accuracy	Mechanical height detection, 1um
		Overall accuracy of patch	Patch accuracy ±3um@3S Angle accuracy ±0.001°@3S
2	Force control system	Pressure range and resolution	5~1500g, 0.1g resolution
3	Optical system	Main PR camera	4.2mm*3.7mm field of view, support 500M pixels
		Back recognition camera	4.2mm*3.7mm field of view, support 500M pixels
4	Nozzle system	Clamping method	Magnetic + vacuum
		Number of nozzle changes	12
		Auto-calibration and auto-switching of nozzles	Support online automatic calibration, automatic switching
		Nozzle detection protection	Support
5	Calibration system	Back view camera calibration Nozzle XYZ direction calibration
6	Functional features	Program compatibility	Product images and location information can be shared with the dispensing machine
		Secondary identification	Possessing secondary recognition function for substrates
		Multi-layer matrix nesting	Possessing multi-layer matrix nesting function for substrates
		Second display function	Visually view material production status information
		Switch of individual points can be set arbitrarily	Can set the switch of any component, and the parameters are independently adjustable
		Support CAD import function
		Product cavity depth	12mm
		System connection	Support SMEMA communication
7	Patch module	Compatible with patches at different heights and angles
		The program automatically switches nozzles and components
		The chip picking parameters can be modified independently/in batches	The chip picking parameters include the approach height before chip picking, the approach speed of chip picking, the pressure of chip picking, the height of chip picking, the speed of chip picking, the vacuum time and other parameters
		The chip placement parameters can be modified independently/in batches	The chip placement parameters include the approach height before chip placement, the approach speed before chip placement, the pressure of chip placement, the height of chip placement, the speed of chip placement, the vacuum time, the backflush time and other parameters
		Back recognition and calibration after chip picking	It can support the back recognition of chips in the size range of 0.2-25mm
		Chip position center deviation	No more than ±3um@3S
		Productivity efficiency	No less than 1500 components/hour (taking the chip size of 0.5*0.5mm as an example)
8	Material system	Compatible number of waffle boxes/gel boxes	Standard 2*2 inches 24 pieces
		Each box bottom can be vacuumed
		Vacuum platform can be customized	Vacuum adsorption area range can reach 200mm*170mm
		Compatible chip size	Depends on the tip matching Size: 0.2mm-25mm Thickness: 30um-17mm
9	Equipment safety and environmental requirements Air system	Device shape	Length*depth*height: 840*1220*2000mm
		Device weight	760Kg
		Power supply	220AC±10%@50Hz,10A
		Temperature and humidity	Temperature: 25ºC±5ºC Humidity: 30%RH~60%RH
		Compressed air source (or nitrogen source as an alternative)	Pressure>0.2Mpa, flow>5LPM, purified air source
		Vacuum	Pressure<-85Kpa, pumping speed>50LPM

For dispensing platform

N0.	Component name	Index name	Detailed indicator description
1	Motion platform	Movement stroke	XYZ-250mm*320mm*50mm
		Size of mountable products	XYZ-200mm*170mm*50mm
		Displacement resolution	XYZ-0.05um
		Repeat positioning accuracy	XY axis: ±2um@3S Z axis: ±0.3um
		Maximum operating speed of XY axis	XYZ=1m/s
		Limit function	Electronic soft limit + physical limit
		Rotation range of rotation axis θ	±360°
		Rotation resolution of rotation axis θ	0.001°
		Probing height method and accuracy	Mechanical height detection, 1um, the height detection of any point can be set;
		Overall dispensing accuracy	±3um@3S
2	Dispensing module	Minimum glue dot diameter	0.2mm (using 0.1mm diameter needle)
		Dispensing mode	Pressure-time mode
		High-precision dispensing pump, control valve, automatic adjustment of positive/negative dispensing pressure
		Dispensing air pressure setting range	0.01-0.6MPa
		Support dotting function, and parameters can be set arbitrarily	Parameters include dispensing height, pre-dispensing time, dispensing time, pre-collecting time, dispensing pressure and other parameters
		Support glue stripping function, and parameters can be set arbitrarily	Parameters include dispensing height, pre-dispensing time, glue speed, pre-collecting time, glue pressure and other parameters
		High compatibility of dispensing	It has the ability to dispense glue on planes at different heights, and the glue type can be rotated at any angle
		Custom glue stripping	The glue type library can be directly called and customized
3	Material system	Vacuum platform can be customized	Vacuum adsorption area range up to 200mm*170mm
		Glue packaging (standard)	5CC (compatible with 3CC)
		Pre-marked glue board	Can be used for parameter height of dotting and glue-scribing mode, and pre-scribing before glue-dispensing production
4	Calibration system	Glue needle calibration	Calibration of glue-dispensing needle XYZ direction
5	Optical system	Main PR camera	4.2mm*3.5mm field of view, 500M pixels
		Identify substrate/component	Can normally identify common substrates and components, and special substrates can be customized with recognition function
6	Functional features	Program compatibility	Product images and location information can be shared with the placement machine
		Chip position center deviation	No more than ±3um@3S
		Productivity efficiency	No less than 1500 components/hour (taking 0.5*0.5mm chip size as an example)
		Secondary identification	Has substrate secondary recognition function
		Multi-layer matrix nesting	Has substrate multi-layer matrix nesting function
		Second display function	Visually view material production status information
		Switch of individual points can be set arbitrarily	Can set the switch of any component, and the parameters are independently adjustable
		Support CAD import function
		Product cavity depth	12mm
7	Equipment safety and environmental requirements Gas system	Equipment shape	Length*depth*height: 840*1220*2000mm
		Equipment weight	760Kg
		Power supply	220AC±10%@50Hz, 10A
		Temperature and humidity	Temperature: 25ºC±5ºC
		Compressed air source (or nitrogen source as an alternative)	Humidity: 30%RH~60%RH
		Vacuum	Pressure>0.2Mpa, flow>5LPM, purified air source

Product Details:

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. 
Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. 

FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.