Heavy Wire Bonder Wire Bonding Machine for to Package

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Model NO.: MDAWB-LS702S
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Trademark: minder-hightech
• Origin: China

Product Description

Heavy Wire Bonder for TO package

Applications

Double bonding head for higher production efficiency

Stable bonding force control improve bonding quality and reliability

Programmable ultrasonic power at different stages

Real-time bond line length detection on-line

Tension detection to ensure product quality

 

Specifications

No.	Description	Parameter
1	Work area	X axis:110mm/1um        Y axis:105mm/1um
		Z axis:50mm/1um          T axis: +/-360degree/0.01degree
2	Wire size:	5mil-20mil(125um~500um)
3	Ribbon wire:	20*4 mil to 80*10mil
4	Wire Cutter:	Front/Rear Cut
5	Wire feed system:	Motorized with High Resolution Encoder Feedback
6	Wire loss detection:	Encoder and Bond Power Detection Method
7	Maximum Wire Length:	Realtime Monitoring
8	Max.loop height:	Programmeable
9	Min.loop height:	Programmeable
10	Bond Force:	Aluminum wire:50g-1500g
		Ribbon wire:100g-3500g
11	Ultrasonic Transducer:	60KHz or 80KHz
12	Ultrasonic generator:	60KHz or 80KHz@30W~100W
13	UPH	3.6K
14	Power	AC220V,50Hz,2000W
15	Dimension	1070mm(W)x1800mm(L)x1760mm(H)
16	weight	1300kg

We have 16 years of experience in equipment ,
and can provide you with a one-stop IC Package Line Equipment solution