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Thick-film sintering furnace is widely used in 1100 ºC following products in the protective atmosphere or air in the pre-burning, burning or heat treatment, including conductor paste, resistance and thick media dielectric slurry circuit, resistors, capacitors, inductors and other electronic components End burning silver, firing, the circuit casing, crystal and other components of the glass insulator firing and metal heat treatment. Kiln temperature zone design sophisticated, ultra-light material insulation, single-loop intelligent regulator control, with fast heating, high precision temperature control, temperature uniformity and reliability, energy saving and other characteristics, universities, research institutes, factories and enterprises product research and bulk The ideal equipment for production.
Thick film technology is used to manufacture single electronic parts like resistors and capacitors, hybrid circuits, heating elements, sensors and display systems. The substrate materials are ceramics (Al2O3, AlN, BeO2, ZrO2), glass, PCB's, metals covered by an insulation layer (Porcelain Enameled Steel) and thermal print heads. Thick film material can be based on low melting glass, CERMET, polymers or organometallics.
The thick film layers are mostly deposited by screen printing. In special cases they are structured by photolithography too.
Thick film paste contains binders and solvents. The first step is a pre-drying to remove solvents. After that, a special firing procedure is to be carried out in order to remove binders and to get the desired parameters. There are two important things: temperature profile and gas flow. The temperature-versus-time profile is given by the thick film paste suppliers.
There are standard profiles for CERMET pastes among the many special processes, different by a total heat treatment time from 30 to 60 minutes. These profiles have a plateau at 850°C for 10 minutes. During heating up to 600°C the binder burns out. The zone in the furnace where this occurs is called the burnout zone.
After burning out, the film is fired up to 850°C in order to get the right electrical and mechanical data. Last, the treated films must cool down. A thick film firing furnace is equipped with a special air flow system. The evaporated binder has to be sucked away, keeping the firing area free from contamination. All feeding air has to be very clean, particularly free of oil and water (dew point less than -50°C).
| model | MD-H0711 | ||
| Max Temperature | 1050ºC | Conveyor Speed | 30-200mm(1.2"-8")/min |
| Rate Temperature | 900 deg. c | Overall System Width | 1200mm/47" |
| Belt Width | ≤1000mm | Overall System Length | 6905mm/272" |
| Tunnel Height | 300/450/600mm | Overall System Height | 1350mm/53" |
| Heating Length | 3150mm/124" | Typical Temp. Uniformity | +/-3 deg. c |
| Cooling Length | 1905mm/75" | Net Weight | 1200kg |
| Control Zones | 7~11 | Spare Part | 1 set heating board, 1 solid State Relay |
| Temperature uniformity of cross section |
± 2ºC | Atmosphere | Air/Nitrogen |
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