Super Precision Blade Dicing Saw for Wafer Cutting

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Transport Package: Wooden Crate
Diamond Member Since 2017

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  • Super Precision Blade Dicing Saw for Wafer Cutting
  • Super Precision Blade Dicing Saw for Wafer Cutting
  • Super Precision Blade Dicing Saw for Wafer Cutting
  • Super Precision Blade Dicing Saw for Wafer Cutting
  • Super Precision Blade Dicing Saw for Wafer Cutting
  • Super Precision Blade Dicing Saw for Wafer Cutting
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Basic Info.

Specification
665mm*850mm*1650mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Super Precision Blade Dicing Saw for Wafer Cutting
DS613 
Precision dicing machine


    DS613 The precision scribing machine is equipped with a 15-inch LCD touch screen, GUI interface is friendly, easy to align the workpiece; DS-300 software control system is adopted, the frame is reasonable, the operation is convenient, and the production efficiency is improved; the equipment performance is stable, the reliability is high, and the maintenance cost Low.
Super Precision Blade Dicing Saw for Wafer CuttingSuper Precision Blade Dicing Saw for Wafer CuttingProduct parameter
Configuration and performance Processing size φ160mm or φ150mm
Groove depth <=4mmor customized
Flatness of worktable ±0.005mm/100mm
Alignment system 70* straight light+ring light (210*optional)
Spindle range of rotation 3000~40000rpm
Output Power 1.25KW
X-axis Drive way servo motor
Workbench left and right stroke 240mm
Stroke resolution 0.001mm
Speed setting range 0.1~400mm/s
Y-axis Drive way Stepping motor + grating closed loop control system
Spindle back and forth stroke 170mm
Stroke resolution 0.0005mm
Single-step positioning accuracy <=0.003mm/5mm
Full positioning accuracy <=0.005mm/170mm
Z-axis Drive way Stepper motor
Spindle up and down stroke 30mm
Stroke resolution 0.001mm
Repeatability 0.001mm
θ-axis Drive way DD motor
Angle range 380º
Angle resolution 0.0005º
Basic specifications power supply Single phase,AC220V±10%,3.0kVA
power consumption
Compressed air
0.6KW during processing (reference value)
When warming up 0.4KW (reference value)
Cutting water Pressure 0.5~0.6Mpa, maximum consumption 180L/min
Cooling water Pressure 0.2~0.3Mpa, maximum consumption 3.0L/min
Exhaust volume Pressure 0.2~0.3Mpa, maximum consumption 1.5L/min
Overall size W×D×H 1.5m³/min(ANR)
weight 665mm×850mm×1650mm
power consumption 500kg
Super Precision Blade Dicing Saw for Wafer CuttingDS616--precision dicing machine
The precision dicing machine is equipped with an imported 1.5kw high-speed spindle; driven by the θ-axis DD motor, the accuracy of the rotation angle, the resolution of the rotation angle, and the flatness of the table are improved; the power distribution system is upgraded, and multiple functions can be selected according to customer needs.
Super Precision Blade Dicing Saw for Wafer Cutting

Product parameter
Configuration and performance Processing size φ160mm or φ150mm
Groove depth <=4mm or customized
Flatness of worktable ±0.005mm/150mm
Alignment system 70x straight light+ring light (210x optional)
Spindle range of rotation 10000~50000rpm
Output Power 1.5KW
X axis Drive way servo motor
Workbench left and right stroke 240mm
Stroke resolution 0.001mm
Speed setting range 0.1~400mm/s
Y axis Drive way Stepping motor + grating closed loop control system
Spindle back and forth stroke 170mm
Stroke resolution 0.0005mm
Single-step positioning accuracy <=0.003mm/5mm
Full positioning accuracy <=0.005mm/170mm
Z axis Drive way Stepper motor
Spindle up and down stroke 30mm
Stroke resolution 0.001mm
Repeatability 0.001mm
θ axis Drive way DD motor
Angle range 380º
Angle resolution 0.0002º
Basic specifications power supply Single phase, AC220V±10%, 3.0kVA
power consumption 0.6KW during processing (reference value)
When warming up 0.4KW (reference value)
Compressed air Pressure 0.5~0.6Mpa, maximum consumption 200L/min
Cutting water Pressure 0.2~0.3Mpa, maximum consumption 3.0L/min
Cooling water Pressure 0.2~0.3Mpa, maximum consumption 1.5L/min
Exhaust volume 1.5m³/min(ANR)
Dimensions W×D×H 665mm×850mm×1650mm
weight 500kg
Features:
√ Blade database management
√ Workpiece cutting database management
√ Auto focus function
√ Two-way lifting knife cutting function
√ Compensation function for blade exposure
√ Multiple safety guarantees and alarm functions 
Conditions of Use:
1. Please set the machine in an environment of 20~25ºC (the fluctuation range is controlled within ±1ºC); the indoor humidity should be 40%~60%, keep constant without condensation.
2. Please use clean compressed air with atmospheric pressure dew point below -15ºC, residual oil content of 0.1ppm and filtration degree above 0.01um/99.5.
3. Please control the water temperature of the cutting water to room temperature 2ºC (fluctuation range within ±1ºC), and control the cooling water temperature to be the same as room temperature (fluctuation range control within ±1ºC).
4. Please avoid the device from gravitational impact and any external vibration threats. In addition, please do not install the equipment near blowers, vents, devices that generate high temperatures, and devices that generate oil.
5. Please install this equipment on a waterproof floor and a place with drainage treatment.
6. Please operate strictly in accordance with the company's product instruction manual.
Application areas: diodes, triodes, LED packaging, NTC, MEMS, IC, photovoltaics, medical devices, scintillation crystals
Precision cutting materials: silicon wafer, PCB board, EMC, ceramics, glass, quartz, gallium arsenide, lithium niobate, sapphire, crystal
Auto focus function:
Through the visual algorithm, coordinated with the motion control, the lens can be automatically raised and lowered, and the clear position of the workpiece image can be quickly obtained.
Accessories Consumables
Super Precision Blade Dicing Saw for Wafer CuttingSuper Precision Blade Dicing Saw for Wafer CuttingSuper Precision Blade Dicing Saw for Wafer Cutting
Brand customers

Well-known company
Super Precision Blade Dicing Saw for Wafer CuttingColleges and universities
Super Precision Blade Dicing Saw for Wafer Cutting
Factory
Super Precision Blade Dicing Saw for Wafer Cutting
 

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