High Precision Eutectic Wafer Bonder Chip Bonding Equipment with Die Attach System Eutectic Crystal Planting Machine

• After-sales Service: 1 Year
• Condition: New
• Speed: Super High Speed
• Model NO.: MDZW-TP2032
• Precision: High Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Weight: 800
• Power Supply: AC220V Earth 10%, 50-60Hz, 10A
• Compressed Air: >=0.2MPa, Flow Rate>5lpm,
• Thickness: 50um-17mm
• Transport Package: 840 * 1220 * 2000mm
• Specification: 840 * 1220 * 2000mm
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

Since 2014,One-stop Professional Solution for 
Semiconductor Front-end and IC TO Package Equipments Line

 

Die Attach Machine


Features
1. Using graphical operation programming to effectively improve programming efficiency and reduce personnel requirements
2. Implement universal nozzle soft contact, effectively solving the problem of damage to the surface air bridge of GaAs chips
3. Automatic dispensing and automatic SMT are separated and operate independently, with shared parameter coordinates and recognition heights
4. Real time closed-loop pressure control+buffering mechanism, effectively reducing damage to the air bridge
5. Multi material support+multiple suction nozzles, suitable for multi chip mounting, compatible with chip rotation and offset
6. Main light+7 circular lights, effectively dealing with different interfaces

Parametric Metrics

Model	MDZW-TP2032
XYZ axis	stroke 200mm * 320mm * 50mm
Platform repeated positioning accuracy	soil 2um@3s
Equipment comprehensive positioning accuracy	soil 3um@3s Soil 0.1@3s (Standard Plate Test)
UPH	1000-1500 (with camera calibration) 2000-2500 (without camera calibration)
Adhesive pressure	5-1500g 0.1g resolution real-time full closure control
Chip size	length * width: 0.17mm-25mm
Thickness	50um-17mm
Optical system	Main camera 4.2mm * 3.5mm field of view range Auxiliary camera 4.2mm * 3.5mm field of view
Suction nozzle	quantity of 12, supporting automatic replacement and online automatic calibration
Material system	support 24 gel boxes/waffle boxes, optional rail or workbench mode
External dimensions of individual automatic SMT machine	840 * 1220 * 2000mm (excluding connecting device)
Weight	800KG
Power supply	AC220V earth 10%, 50-60HZ, 10A
Compressed air	>=0.2MPa, flow rate>5LPM,
Purification gas source vacuum pipeline pressure	<-85Kpa, pumping speed>50LPM

Frequently Asked Questions

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.