After-sales Service: | 1 Year |
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Condition: | New |
Speed: | Super High Speed |
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Die Attach Machine
Model | MDZW-TP2032 |
XYZ axis | stroke 200mm * 320mm * 50mm |
Platform repeated positioning accuracy | soil 2um@3s |
Equipment comprehensive positioning accuracy | soil 3um@3s Soil 0.1@3s (Standard Plate Test) |
UPH | 1000-1500 (with camera calibration) 2000-2500 (without camera calibration) |
Adhesive pressure | 5-1500g 0.1g resolution real-time full closure control |
Chip size | length * width: 0.17mm-25mm |
Thickness | 50um-17mm |
Optical system | Main camera 4.2mm * 3.5mm field of view range Auxiliary camera 4.2mm * 3.5mm field of view |
Suction nozzle | quantity of 12, supporting automatic replacement and online automatic calibration |
Material system | support 24 gel boxes/waffle boxes, optional rail or workbench mode |
External dimensions of individual automatic SMT machine | 840 * 1220 * 2000mm (excluding connecting device) |
Weight | 800KG |
Power supply | AC220V earth 10%, 50-60HZ, 10A |
Compressed air | >=0.2MPa, flow rate>5LPM, |
Purification gas source vacuum pipeline pressure | <-85Kpa, pumping speed>50LPM |