Automatic Die Attach Machine Die Attachment Equipment Die Bonder Mat Datacon

• After-sales Service: 1 Year
• Condition: New
• Speed: Super High Speed
• Precision: High Precision
• Certification: CE
• Warranty: 12 Months
• Model NO.: MDZW-TP2032
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

Die Attach Machine
MDZW-TP2032

Features
1. Using graphical operation programming to effectively improve programming efficiency and reduce personnel requirements
2. Implement universal nozzle soft contact, effectively solving the problem of damage to the surface air bridge of GaAs chips
3. Automatic dispensing and automatic SMT are separated and operate independently, with shared parameter coordinates and recognition heights
4. Real time closed-loop pressure control+buffering mechanism, effectively reducing damage to the air bridge
5. Multi material support+multiple suction nozzles, suitable for multi chip mounting, compatible with chip rotation and offset
6. Main light+7 circular lights, effectively dealing with different interfaces

Parametric Metrics

Model	MDZW-TP2032
XYZ axis	stroke 200mm * 320mm * 50mm
Platform repeated positioning accuracy	soil 2um@3s
Equipment comprehensive positioning accuracy	soil 3um@3s Soil 0.1@3s (Standard Plate Test)
UPH	1000-1500 (with camera calibration) 2000-2500 (without camera calibration)
Adhesive pressure	5-1500g 0.1g resolution real-time full closure control
Chip size	length * width: 0.17mm-25mm
Thickness	50um-17mm
Optical system	Main camera 4.2mm * 3.5mm field of view range Auxiliary camera 4.2mm * 3.5mm field of view
Suction nozzle	quantity of 12, supporting automatic replacement and online automatic calibration
Material system	support 24 gel boxes/waffle boxes, optional rail or workbench mode
External dimensions of individual automatic SMT machine	840 * 1220 * 2000mm (excluding connecting device)
Weight	800KG
Power supply	AC220V earth 10%, 50-60HZ, 10A
Compressed air	>=0.2MPa, flow rate>5LPM,
Purification gas source vacuum pipeline pressure	<-85Kpa, pumping speed>50LPM