Automatic Die Attach Machine Die Attachment Equipment Die Bonder Mat Datacon

Product Details
After-sales Service: 1 Year
Condition: New
Speed: Super High Speed
Still deciding? Get samples of US$ 100/Piece
Request Sample
Diamond Member Since 2017

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Registered Capital
1000000 RMB
  • Automatic Die Attach Machine Die Attachment Equipment Die Bonder Mat Datacon
  • Automatic Die Attach Machine Die Attachment Equipment Die Bonder Mat Datacon
  • Automatic Die Attach Machine Die Attachment Equipment Die Bonder Mat Datacon
Find Similar Products
  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
MDZW-TP2032
Precision
High Precision
Certification
CE
Warranty
12 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Weight
800
Power Supply
AC220V Earth 10%, 50-60Hz, 10A
Compressed Air
>=0.2MPa, Flow Rate>5lpm,
Thickness
50um-17mm
Transport Package
840 * 1220 * 2000mm
Specification
840 * 1220 * 2000mm
Trademark
minder-hightech
Origin
China
Production Capacity
100

Product Description

Product Description

 

Die Attach Machine
MDZW-TP2032

Automatic Die Attach Machine Die Attachment Equipment Die Bonder Mat Datacon
Features

1. Using graphical operation programming to effectively improve programming efficiency and reduce personnel requirements
2. Implement universal nozzle soft contact, effectively solving the problem of damage to the surface air bridge of GaAs chips
3. Automatic dispensing and automatic SMT are separated and operate independently, with shared parameter coordinates and recognition heights
4. Real time closed-loop pressure control+buffering mechanism, effectively reducing damage to the air bridge
5. Multi material support+multiple suction nozzles, suitable for multi chip mounting, compatible with chip rotation and offset
6. Main light+7 circular lights, effectively dealing with different interfaces

Parametric Metrics
Model MDZW-TP2032
XYZ axis stroke 200mm * 320mm * 50mm
Platform repeated positioning accuracy soil 2um@3s
Equipment comprehensive positioning accuracy soil 3um@3s Soil 0.1@3s (Standard Plate Test)
UPH 1000-1500 (with camera calibration)
2000-2500 (without camera calibration)
Adhesive pressure 5-1500g 0.1g resolution real-time full closure control
Chip size length * width: 0.17mm-25mm
Thickness 50um-17mm
Optical system Main camera 4.2mm * 3.5mm field of view range
Auxiliary camera 4.2mm * 3.5mm field of view
Suction nozzle quantity of 12, supporting automatic replacement and online automatic calibration
Material system support 24 gel boxes/waffle boxes, optional rail or workbench mode
External dimensions of individual automatic SMT machine  840 * 1220 * 2000mm (excluding connecting device)
Weight  800KG
Power supply AC220V earth 10%, 50-60HZ, 10A
Compressed air >=0.2MPa, flow rate>5LPM,
Purification gas source vacuum pipeline pressure   <-85Kpa, pumping speed>50LPM
Automatic Die Attach Machine Die Attachment Equipment Die Bonder Mat DataconAutomatic Die Attach Machine Die Attachment Equipment Die Bonder Mat Datacon
 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier