Simplified Wafer Lapping Machine for 12" Wafer

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Weight: 760kg
Diamond Member Since 2017

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Registered Capital
1000000 RMB
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Basic Info.

Model NO.
mdfd-320
Dimension(mm)
1200*550*1550
Parallelism
1um(for D100mm)
Max Material Size
150
Transport Package
Plywood
Specification
1000kg
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8486209000
Production Capacity
100/Year

Product Description

simplified wafer lapping machine for 12" waferSimplified Wafer Lapping Machine for 12" Wafer

Application:

      This ginder is suitable for high hardness,thin,and high precision product. like LED sapphire substrate,quartz crystal,silicon wafer,ceramic,wolfram plate, germanium plate thinning(grinding)

 

Principle:

     This machine is automatic precision grinding machine,the sucker/chuck(either vacuum type or electromagnetism type) suck the wafer and rotary opposite from the grinding wheel,the grinding wheel feeding by driving system. this method has low drag force,will not broke the wafer,and high productivity.

This machine can auto aiming the tool, actually test the grinding torque,automatic adjust the grinding speed, so to avoid broking the wafer.

 

1,Can grind the wafer to 80um, and the planeness and parallelism can be +-0.002mm.

2,High speed, LED sapphire substrate can be 48um/minute, silicon wafer can be 250um/minute.

 

Specification:

Model

MDYM-150WH

MDYM-180WH

MDYM-200WH

MDYM-230WH

MDYM-300WH

Grinding wheel

D150*h25mm

D180*h25mm

D200*h30mm

D230*h30mm

D300*h30mm

Max material size

D150mm

D180mm

D200mm

D230mm

D300mm

Material spindle speed(adjustable)

0-1000rpm

0-1000rpm

 0-800rpm

 0-800rpm

 0-800rpm

Grinding wheel speed(adjustable)

0-2000rpm

0-2000rpm

0-1800 rpm 

0-1800 rpm 

0-1800 rpm 

Grinding wheel motor power

1.5kw/3*380V

1.5kw/3*380V

2.2kw/3*380V

2.2kw/3*380V

2.2kw/3*380V

Material spindle motor power

0.75kw/3*380V

0.75kw/3*380V

0.75kw/3*380V

0.75kw/3*380V

1.1kw/3*380V

Parallelism

1um(for D100mm)

1um(for D100mm)

1um(for D100mm)

1um(for D100mm)

1um(for D100mm)

Dimension(mm)

1200*550*1550

1200*550*1550

1350*600*1600

1350*600*1600

1500*700*1650

Weight

760kg

850kg

960kg

1000kg

1100kg


some grinding sample:
Simplified Wafer Lapping Machine for 12" Wafer

factory view:
Simplified Wafer Lapping Machine for 12" Wafer
Simplified Wafer Lapping Machine for 12" Wafer

Other type of grinder and polisher:

Simplified Wafer Lapping Machine for 12" Wafer

-----------------------------------------------------------------------------------------------------------------------------------------------------------Simplified Wafer Lapping Machine for 12" Wafer

guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
 
 



 

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