Spin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer Dryer

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Movement Way: Combined
Diamond Member Since 2017

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Registered Capital
1000000 RMB
  • Spin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer Dryer
  • Spin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer Dryer
  • Spin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer Dryer
  • Spin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer Dryer
  • Spin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer Dryer
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  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
0
Atomization
Rotary Atomization
Flow
Cross Flow
Heating Mode
Dielectric
Material Status
Solution
Drying Medium
Inactive Gas
Operation Pressure
Vacuum
Operational Method
Continuous
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Product Description

 

spin rinse dryer dual chamber

Spin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer DryerSRD spin rinse wafer dryer
Spin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer DryerSpin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer DryerSpin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer Dryer
Features

* Reasonable structure design and mature process technology
* Good drying effect and high process cleanliness
* Small vibration, good reliability, and applicable to thin plates
* Simple operation, convenient maintenance, stable and reliable operation of the whole machine
technical parameter
Wafer size: applicable to 1-12 inch production line
Fragment rate: 1/10000
application area
SPM acid cleaning, organic cleaning, developing, degumming, ITO etching, BOE etching, uniform gluing and other process wafer drying
Equipment function
The equipment is divided into single cavity and double cavity, which is used for wet drying of various semiconductor application materials such as 1-inch, 2-inch, 4-inch, 5-inch, 6-inch, 8-inch, 12-inch standard size wafers, non-standard size wafers and square wafers, silicon wafers, potassium nitride, gallium arsenide, sapphire, mask and so on.
rocess parameters
workmanship STEP Step1 Step2 Step3 Step4 Step5 Step6 Step7 Step8 Step9 Step10
Time (s) 0-999 0-999 0-999 0-999 0-999 0-999 0-999 0-999 0-999 0-999
speed (r/min) 0-2500 0-2500 0-2500 0-2500 0-2500 0-2500 0-2500 0-2500 0-2500 0-2500
Flushing Optional Optional Optional Optional Optional Optional Optional Optional Optional Optional
Purge Optional Optional Optional Optional Optional Optional Optional Optional Optional Optional
nitrogen Optional Optional Optional Optional Optional Optional Optional Optional Optional Optional
Nitrogen heating Optional Optional Optional Optional Optional Optional Optional Optional Optional Optional
Cavity heating Optional Optional Optional Optional Optional Optional Optional Optional Optional Optional
Electrostatic elimination Optional Optional Optional Optional Optional Optional Optional Optional Optional Optional
Equipment function
Features
* Brushless servo motor drive ensures the stability, reliability and cleanliness of the equipment.
* Labyrinth nitrogen seal, cavity and cavity isolation, non-contact sealing effect, to ensure the process environment requirements.
* PTFE pneumatic valve components, PVDF pipes and connectors are used.
* Made of 316L stainless steel, the surface is electropolished.
* The function of washing, blowing, drying and drying is to use high-speed rotating centrifugal force to remove the residual attached chemical reagent and particle dust, and clean nitrogen to take away the residual particle dust to make the product surface clean, dry and clean.
* Electrostatic elimination function. When the product moves at high speed, it will generate static electricity. Use the high-voltage electrostatic removal device to make the product surface reach the neutral state.
* Conductivity monitoring, monitoring the cleaning water quality and the residual attached chemical reagent and particle dust on the product surface, which do not meet the requirements before drying, prompt and give a warning to prevent the defective products from entering the next process.
*Stainless steel heater nitrogen heating, heating membrane cavity heating, PID temperature precision control, can choose to preheat in advance. The automatic cleaning function can be selected, and the interval can be set to ensure that the equipment is always kept clean.
* 0.003UM nitrogen is filtered to ensure the cleanliness of process gas
* Mechanical self-reset function, stop and standby the cassette upward.
* Nitrogen pressure, door sealing status, cassette upward and other conditions are protected.
* The control unit is controlled independently, operates independently, and is easy to operate and maintain.
Spin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer DryerSpin Rinse Dryer Dual Chamber Process Drying and Spin Drying Srd Wafer Dryer

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