Guangdong, China
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Manufacturing & Processing ...
Year of Establishment:
Registered Capital:
147802.18 USD
Main Markets:
South America, Europe, Southeast Asia/ Mideast
Sample Available

Ball Bonding Machine, Automatic Ball Bonding Machine, Automatic Wire Bonding Machine manufacturer / supplier in China, offering Automatic Ultrasonic Gold Wire Ball Bonding Machine, China Best Price 30V 60A Lithium Battery Analyzer Capacity Testing Machine, 30V60A High-Precision Battery Test Instrument and so on.

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Automatic Ultrasonic Gold Wire Ball Bonding Machine

Min. Order / Reference FOB Price
1 Piece US $1-45,000/ Piece
Port: Guangzhou, China
Production Capacity: 200PCS/Year
Payment Terms: T/T
Transport Package: Plywood Packing by Sea
Specification: 900kg
Trademark: minder-hightech
Origin: Guangzhou

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Basic Info.

Model NO.
HS Code
Automatic Ultrasonic Gold Wire Ball Bonding Machine
Automatic Ultrasonic Gold Wire Ball Bonding Machine
Automatic Ultrasonic Gold Wire Ball Bonding Machine
Automatic Ultrasonic Gold Wire Ball Bonding Machine


Application:IC(SOP,SOT,DIP,BGA,COB),LED(SMD,COB,High power,Integration)

Bonding principle: ultrasonic.

System:windows XP based.

Min wire diameter:0.5mil.


Wire material:gold/copper/alloy/silver.


Bonding speed:50ms/wire

Bonding accuracy:+-3.0um

Wire length:Max:8mm

Wire diameter:15-50um

Bonding area:56-65mm

Bonding type:single wire/BSOB/BBOS

XY resolution:0.1um

Transducer system:138khz

PR accuracy:+-0.37um(4x),+-0.74(2x)

Applicable magazine:

L:120-305mm  W:45-98mm H:50-180mm

Magazine pitch:Min:1.4mm

Applicable lead frame:

L:100-300mm W:40-90mm T:0.1-1.3mm

Voltage:190-240V 50Hz

Compressed air:0.6-0.97bar

Air consumption:80L/min




guangzhou minder-hightech co.,ltd  

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