Mdsy-Bc6076 Wafer Level Ball Correct System

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Model NO.: MDSY-BC6076
• Automatic Grade: Automatic
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 1000

Product Description

MDSY-BC6076 Wafer Level ball Correct System
Features
1. Applicable wafer: 12'' wafer & 8'' wafer
2. Tact time
Inspection time: 0.55 [sec/field of view]
Repair time: 2.8 [sec/ball] (including Flux transfer)
3. Ball size / pitch:Φ60/100(Min)~ Φ300 [um]
4. Mounting accuracy: Less than ±15 [um]

Excluding the ball head:
Remove balls with abnormal positions from the wafer through vacuum and rotation.
The suction state of the ball is detected through a flow meter for analog analysis of flow meters with different ball diameters. Different flow rates adapt to different suction states of ball diameters.
Residual ball cleaning mechanism: By rubbing with a brush, the absorbed balls are collected and recycled.

Glue head: equipped with a floating structure, precise calibration of dispensing height, protection of wafers, and prevention of damage.

Ball planting head: equipped with ball suction function, corresponding to different ball diameters, detecting the suction status through a flow meter, and protecting the tin ball and wafer safety with a floating joint.

Visual precise positioning: Before ball planting and dispensing, the specific operation position is detected by a camera, closely adjacent to the work point, to improve positioning accuracy.



Parameters
 

Stage size	8, 12[inch]	MAX 300x300[mm]
Ball size	Ф50[um]~ Ф300[μm]
Min. ball pitch	90[um](Ф50[um] ball)
Alignment accuracy	+15[um]
Dimensions	3,065W x 1,700D x 1,650H[mm]
Weight	Approx. 2,900[kg]
Loader/ Unloader	Open cassette, FOUP	Customizable