Ultrasonic Wire Bonder for Battery Pack Battery Connections and Power Modules

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Model NO.: MDAWB-LS702S
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Trademark: minder-hightech
• Origin: China

Product Description

Ultrasonic Wire Bonder
for Battery Connections and Power Modules


Applications

Stable bonding force control improves bonding quality and reliability

Programmable ultrasound power at different stages

Real time bond wire length detection

Online monitoring and management, remote control and software upgrade

Specifications

No.	Description	Parameter
1	Work area	X axis:300mm/1um       Y axis:300mm/1um Z axis:50mm/1um          T axis: +/-360 degree/0.01 degree
2	Wire size	5mil-20mil(125um~500um)
3	Ribbon wire	20*4 mil to 80*10mil
4	Wire Cutter	Front/Rear Cut
5	Wire feed system	Motorized with High Resolution Encoder Feedback
6	Wire loss detection	Encoder and Bond Power Detection Method
7	Maximum Wire Length	Realtime Monitoring
8	Max.loop height	Programmeable
9	Min.loop height	Programmeable
10	Bond Force	Aluminum wire:50g-1500g Ribbon wire:100g-3500g Copper wire: 100g-5000g
11	Ultrasonic Transducer	60KHz or 80KHz
12	Ultrasonic generator	60KHz or 80KHz@30W~100W
13	Wire cycle	1 s
14	Power	AC220V, 50Hz, 2000W
15	Dimension	960mm(W)x1400mm(L)x1700mm(H)
16	weight	900kg

We have 16 years of experience in equipment ,
and can provide you with a one-stop IC Package Line Equipment solution