Semiconductor Device Fabrication Fab Inner Diameter Circle Slicer Grinder and Polisher MD-IDC6080

• After-sales Service: 1 Year
• Warranty: 1 Year
• Certification: CE
• Model NO.: MD-IDC6080
• Condition: New
• Weight(Kg): ~1000(Kg)
• Dimensions(mm): 1000mm*1100mm*1600mm
• Pitch Angle of Elevation: ±10º
• Horizontal Angle: ±45º
• Transport Package: 1000mm*1100mm*1600mm
• Specification: 1000mm*1100mm*1600mm
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

Product Description

 

Inner diameter slicer and optical edger

Product description: Inner diameter circle slicer MD-IDC6080

Details
Inner circle fully automatic slicing machine is using inside circle to cut a variety of semiconductors, crystal, ceramic, NdFeB magnetic material.
Installed in the spindle, the edge-type Diamond blade cutter is high-speed rotating, the table was feeding by computer control of horizontal and vertical movement, the material on the fixture of the table was cut into the required product.
We have the semi-automatic/fully automatic inner circle clicking machine, within a circle slicer two kinds of specifications, a variety of models. For the Automatic Slicer inner circle. a worker can operate about 16 units slicer at the same time

MD-IDC6080

Main technical parameters
Max machining size(mm):	φ60 ×80mm
Cutting speed (²/):	3-6(²/)
Degree of balance sheets by cutting deviation(mm):	±0.005
Cutting film thickness(mm):	≥0.30
The thin-cut tolerance (mm):	±0.015
Horizontal stroke(mm):	120
Longitudinal travel(mm):	100
Longitudinal degrees:	0-100Grid, each grid To 0.01,Each turn a lap in order to1
Spindle Electrical:	3 Phase 380V0.75kw
Spindle Speed (r/min):	3500Rev /min
Adjust the amount of work table:
Horizontal angle:	±45º
Pitch angle of elevation:	±10º
Vertically(mm):	24
Cooling tank capacity(kg) :	50kg
Cooling tank motor:	3 Phase 380V 0.12kw 2780r/min
Power:	Three-phase four-wire 50Hz 380V
Dimensions(mm):	1000mm*1100mm*1600mm
Weight(kg):	~1000(kg)