Product Overview: MDHWS661 series ultrasonic scanning microscope is a kind of non-destructive testing imaging equipment using ultrasound as the media. It mainly uses high-frequency ultrasound to detect all kinds of semiconductor devices and materials, and can detect the defects such as holes, cracks inclusions delamination inside the sample, and display them in a graphical way. In the scanning process, it will not cause damage to the sample, will not affect the performance of the sample, and can effectively meet the needs of new energy, power electronics, thermal management materials, diamond composite materials, carbon fiber composite materials and other industries.
Product features:
With A scan, B scan, C scan, multi-layer scanning, tray scanning, thickness measurement and other series of scanning modes.
With quantitative measurement and analysis function, visually display the position, shape and size of the internal defects of the tested parts in the form of images, and carry out the size and area statistics of the defects and automatically calculate the percentage of defects in the measured area; With defect size identification; Thickness and ranging functions.
With image coloring function, can automatic color according to phase reversal. Manual coloring according to gray level; Automatic coloring according to thickness changes.
The scanning axis adopts linear motor and granting ruler, which can obtain higher motion accuracy, and the highest resolution is 0.1μm.
Suitable for the raid scanning analysis of a single device, can also be placed in batches of samples synchronous defect identification, quicky screen out unqualified products.
Compatible with 1-230MHz ultrasonic probe.
Testing software independent research and development, English and Chinese interface, can be continuously upgraded according to customer needs.
Industry application: Suitable for water-cooled radiator, lGBT module, ceramic substrate, diamond composite material, carbon fiber composite material, electrical welding parts, ceramic material, target material and other fields.