Mdsy-Zq6076 Wafer Level Ball Mounter

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Model NO.: MDSY-ZQ6076
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Transport Package: Wooden Box Packaging
• Specification: 200*180*220
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 1000

Product Description

MDSY-ZQ6076 Wafer Level Ball Mounter

Features
1. Applicable wafer: 12'' wafer & 8'' wafer
2. Ball size: ф60[um]~ ф760 [um],ф30 [um] in Lab test level
3. Wafer Bump:
a). Min. Bump pitch: 100 [um]
b). Min. Bump pad size: 85 [um]
c). Max. Bump count: 2.2KK [pins]
*The data is subject to device conditions
4. 12" Wafer case:
a). Min. Thickness: 200[μm],100[μm] under lab test level
b). Max Warpage Tolerance:6 [mm]/case,3 [mm]/case
5. Ball mounting Ability
a). Flux Printing Accuracy
Over ф75[um] Ball: +25[um]
Less than ф75[μml Ball: +1/3 of ball diameter
b). Ball mounting Accuracy
Over ф75[um] Ball::±25[um]
Less than ф75[μml Ball: +1/3 of ball diameter
For special case, we can achieve:+13μm
c). Ball Mounting NG Ratio: Less than 30 [ppm]





Parameters
 

Wafer size	8,12 inch wafer
Ball size	Φ60um~Φ760um
Min. ball pitch	100um(Φ60um ball)
Alignment accuracy	±25um
Dimensions	3,595W x1,685D x1,650H [mm
Weight	2,600[kg]
Loader, Unloader	Open Cassette, FOSB, FOUP

We are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience.

Our main products include: Die bonder, Wire bonder, Wafer grinder, Dicing saw, Plasma surface treatment, Photoresist removing machine, Rapid Thermal Processing, RIE, PVD, CVD, ICP, EBEAM, Parallel sealing welder, Terminal insertion machine, capacitor winding machine, Bonding tester, etc.

Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.