Mdsy-Zq6076 Wafer Level Ball Mounter

• After-sales Service: 1 Year
• Condition: New
• Speed: High Speed
• Precision: Precision
• Certification: CE
• Warranty: 12 Months
• Model NO.: MDSY-ZQ6076
• Automatic Grade: Automatic
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 1000

Product Description

MDSY-ZQ6076 Wafer Level Ball Mounter

Features
1. Applicable wafer: 12'' wafer & 8'' wafer
2. Ball size: ф60[um]~ ф760 [um],ф30 [um] in Lab test level
3. Wafer Bump:
a). Min. Bump pitch: 100 [um]
b). Min. Bump pad size: 85 [um]
c). Max. Bump count: 2.2KK [pins]
*The data is subject to device conditions
4. 12" Wafer case:
a). Min. Thickness: 200[μm],100[μm] under lab test level
b). Max Warpage Tolerance:6 [mm]/case,3 [mm]/case
5. Ball mounting Ability
a). Flux Printing Accuracy
Over ф75[um] Ball: +25[um]
Less than ф75[μml Ball: +1/3 of ball diameter
b). Ball mounting Accuracy
Over ф75[um] Ball::±25[um]
Less than ф75[μml Ball: +1/3 of ball diameter
For special case, we can achieve:+13μm
c). Ball Mounting NG Ratio: Less than 30 [ppm]





Parameters
 

Wafer size	8,12 inch wafer
Ball size	Φ60um~Φ760um
Min. ball pitch	100um(Φ60um ball)
Alignment accuracy	±25um
Dimensions	3,595W x1,685D x1,650H [mm
Weight	2,600[kg]
Loader, Unloader	Open Cassette, FOSB, FOUP