Precision Blade Dicing Cutting Saw for Wafer Cutting

Product Details
After-sales Service: 1 Year
Warranty: 1 Year
Transport Package: Wooden Crate
Diamond Member Since 2017

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  • Precision Blade Dicing Cutting Saw for Wafer Cutting
  • Precision Blade Dicing Cutting Saw for Wafer Cutting
  • Precision Blade Dicing Cutting Saw for Wafer Cutting
  • Precision Blade Dicing Cutting Saw for Wafer Cutting
  • Precision Blade Dicing Cutting Saw for Wafer Cutting
  • Precision Blade Dicing Cutting Saw for Wafer Cutting
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Basic Info.

Specification
665mm*850mm*1650mm
Trademark
minder-hightech
Origin
Guangzhou
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year

Product Description

Precision Blade Dicing Cutting Saw for Wafer Cutting
DS820--precision dicing machine

    DS820 The precision dicing machine is equipped with a 15-inch LCD touch screen, with a friendly GUI interface, and easy and convenient to align the workpiece; using the DS-300 software control system, the frame is reasonable, the operation is convenient, and the production efficiency is improved; the equipment has stable performance, high reliability, and maintenance cost Low.

Precision Blade Dicing Cutting Saw for Wafer CuttingPrecision Blade Dicing Cutting Saw for Wafer CuttingProduct parameter
Configuration and performance Processing size φ200mm or φ180mm
Groove depth <=4mm or customized
Flatness of worktable ±0.005mm/100mm
Alignment system 70*Straight light+Ring light (210*optional)
Spindle range of rotation 10000~50000rpm
Output Power 1.5KW
X axis Drive way servo motor
Workbench left and right stroke 380mm
Stroke resolution 0.001mm
Speed setting range 0.1~400mm/s
Y axis Drive way Stepping motor + grating closed loop control system
Spindle back and forth stroke 210mm
Stroke resolution 0.0005mm
Single-step positioning accuracy <=0.003mm/5mm
Full positioning accuracy <=0.005mm/210mm
Z axis Drive way Stepper motor
Spindle up and down stroke 30mm
Stroke resolution 0.001mm
Repeatability 0.001mm
θ axis Drive way DD motor
Angle range 380º
Angle resolution 0.0005º
Basic specifications power supply Single phase, AC220±10%, 3.0kVA
power consumption 0.6KW during processing (reference value)
When warming up 0.4KW (reference value)
Compressed air Pressure 0.5~0.6Mpa, maximum consumption 180L/min
Cutting water Pressure 0.2~0.3Mpa, maximum consumption 3.0L/min
Cooling water Pressure 0.2~0.3Mpa, maximum consumption 1.5L/min
Exhaust volume 2.0m³/min(ANR)
Dimensions W×D×H 775mm*960mm*1650mm
weight 600kg
Precision Blade Dicing Cutting Saw for Wafer Cutting

DS830--precision dicing machine
DS830 The precision dicing machine is equipped with an imported 1.5kw high-speed spindle; driven by the θ-axis DD motor, the accuracy of the rotation angle, the resolution of the rotation angle, and the flatness of the table are improved; the power distribution system is upgraded, and multiple functions can be selected according to customer needs.

Product parameter
Configuration and performance Processing size φ200mm or φ180mm
Groove depth <=4mm or customized
Flatness of worktable ±0.005mm/150mm
Alignment system 70x straight light+ring light (210+optional)
Spindle range of rotation 10000~50000rpm
Output Power 1.5KW (2.4KW optional)
X axis Drive way servo motor
Workbench left and right stroke 380mm
Stroke resolution 0.001mm
Speed setting range 0.1~500mm/s
Y axis Drive way Stepping motor + grating closed loop control system
Spindle back and forth stroke 210mm
Stroke resolution 0.0005mm
Single-step positioning accuracy <=0.003mm/5mm
Full positioning accuracy <=0.005mm/210mm
Z axis Drive way Stepper motor
Spindle up and down stroke 30mm
Stroke resolution 0.001mm
Repeatability 0.001mm
θ axis Drive way DD motor
Angle range 380º
Angle resolution 0.0002º
Basic specifications power supply Single phase, AC220±10%, 3.0kVA
power consumption 0.6KW during processing (reference value)
When warming up 0.4KW (reference value)
Compressed air Pressure 0.5~0.6Mpa, maximum consumption 220L/min
Cutting water Pressure 0.2~0.3Mpa, maximum consumption 3.5L/min
Cooling water Pressure 0.2~0.3Mpa, maximum consumption 1.5L/min
Exhaust volume 2.0m³/min(ANR)
Dimensions W×D×H 775mm×960mm×1650mm
weight 600kg

Features:
√ Blade database management
√ Workpiece cutting database management
√ Auto focus function
√ Two-way lifting knife cutting function
√ Compensation function for blade exposure
√ Multiple safety guarantees and alarm functions
Conditions of Use:
1. Please set the machine in an environment of 20~25ºC (the fluctuation range is controlled within ±1ºC); the indoor humidity should be 40%~60%, keep constant without condensation.
2. Please use clean compressed air with atmospheric pressure dew point below -15ºC, residual oil content of 0.1ppm and filtration degree above 0.01um/99.5.
3. Please control the cutting water temperature to room temperature + 2°C (fluctuation range within ±1°C), and the cooling water temperature to be the same as room temperature (fluctuation range within ±1°C).
4. Please avoid the device from gravitational impact and any external vibration threats. In addition, please do not install the equipment near blowers, vents, devices that generate high temperatures, and devices that generate oil.
5. Please install this equipment on a waterproof floor and a place with drainage treatment.
6. Please operate strictly in accordance with the company's product instruction manual.

Application fields: optical optoelectronics, communication, triode, IC, LED, NTC, photovoltaic, medical equipment, scintillation crystal
Precision cutting materials: blue glass, silicon wafer, gallium arsenide, lithium niobate, alumina, ceramics, quartz, sapphire, crystal, PCB board
Multi-chip cutting function:
For multiple square processed objects, register their positions in the system respectively to realize the alignment and cutting of multiple processed objects.
Accessories Consumables
Precision Blade Dicing Cutting Saw for Wafer CuttingPrecision Blade Dicing Cutting Saw for Wafer CuttingPrecision Blade Dicing Cutting Saw for Wafer Cutting
Brand customers

Well-known company
Precision Blade Dicing Cutting Saw for Wafer CuttingColleges and universities
Precision Blade Dicing Cutting Saw for Wafer Cutting
Factory
Precision Blade Dicing Cutting Saw for Wafer Cutting
 

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