12-Inch Automatic Precision Dicing Machine Wafer Automatic Operation From Loading, Aligning, Cutting, Cleaning to Unloading

• After-sales Service: 1 Year
• Warranty: 1 Year
• Transport Package: Wooden Crate
• Specification: 1200mm*1550mm*1800mm
• Trademark: minder-hightech
• Origin: Guangzhou
• HS Code: 8015809090
• Production Capacity: 200PCS/Yearpcs/Year

Product Description

DS9260--Precision Scribing Machine
    DS9260 is a 12-inch fully automatic precision dicing machine. This model realizes the automatic operation of wafer loading, alignment, cutting, cleaning and unloading. This model is equipped with high-power opposed dual-spindles. Both the Z1 and Z2 axes are equipped with NCS and special microscopes, which greatly reduces the alignment and inspection time, thereby reducing labor costs and improving production efficiency.

Product parameter

Configuration and performance	Processing size	mm	φ12"∣φ275
	Groove depth	mm	<=4mm or customized
Spindle	range of rotation	min­	6000~60000
	Rated output power	KW	DC.2.4at60000min¬
X axis	Effective itinerary	mm	310
	Speed setting range	mm/s	0.1~1000
Y axis	Effective itinerary	mm	310
	Motion resolution	mm	0.0001
	Single positioning accuracy	mm	<=0.002/5
	Full positioning accuracy	mm	0.005/310
Z axis	Effective itinerary	mm	40
	Maximum applicable blade	mm	φ58
	Stroke resolution	mm	0.00005
	Repeatability	mm	0.001
θ axis	Angle range	deg	380
Basic specifications	power supply	kVA	7.0 (three-phase, AC380V)
	Power consumption (reference value)	kw
	Compressed air	Mpa L/min	0.5~0.6 Maximum consumption 550
	Cutting water	Mpa L/min	0.2-0.3 Maximum consumption 9.0
	Cooling water	Mpa L/min	0.2-0.3 Maximum consumption 3.0
	Exhaust volume	m²/min	800
	Size W*D*H	mm	1200*1550*1800
	weight	kg	2000

Features:
√ Integrated cutting and cleaning;
√ Standard non-contact height measurement function (NCS);
√ Optional tool mark detection function;
√ Optional blade breakage detection function (BBD);
√ Optional workpiece shape detection function;
√ Optional data scanning input function;
Equipment workflow:
1. Lower the take-up arm to take out the material to be cut from the wafer box, place the material to be cut on the pre-calibration table for pre-calibration, and then send it to the working plate for dicing.
2. The upper fetching arm moves the cut material from the work plate to the cleaning plate for two-fluid cleaning and wafer drying.
3. Lower the pick arm and put the cut material back into the pre-calibration table for pre-calibration, and then push it back into the wafer box.

Conditions of Use:

1. Please set the machine in an environment of 20~25ºC (the fluctuation range is controlled within ±1ºC); the indoor humidity should be 40%~60%, keep constant without condensation.
2. Please use clean compressed air with atmospheric pressure dew point below -15ºC, residual oil content of 0.1ppm and filtration degree above 0.01um/99.5.
3. Please control the cutting water temperature to room temperature + 2°C (fluctuation range within ±1°C), and the cooling water temperature to be the same as room temperature (fluctuation range within ±1°C).
4. Please avoid the device from gravitational impact and any external vibration threats. In addition, please do not install the equipment near blowers, vents, devices that generate high temperatures, and devices that generate oil.
5. Please install this equipment on a waterproof floor and a place with drainage treatment.
6. Please operate strictly in accordance with the company's product instruction manual.
Application areas: IC, optical and optoelectronics, communications, LED packaging, QFN packaging, DFN packaging, BGA packaging
Precision cutting materials: silicon wafers, lithium niobate, ceramics, glass, quartz, alumina, PCB boards


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