High Precise Single Wire Sawprecision Multi Wire Saw for Silicon Ingot/Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da800
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Product Highlights
- Double Workbench Design: Enables batch processing of super-hard materials like Sapphire and Quartz Crystal.
- Adjustable Wire Guide Rollers: Optional 3 or 5 rollers mode allows cutting slices from 0.5mm to 60mm thickness.
- High Efficiency Cutting: Reduced wire wheels to 7 minimize wire breakage and increase cutting efficiency.
- Swing Slicing Technology: Provides stronger cutting force for precise slicing of hard materials.
- Comprehensive Warranty: 12-month warranty with free parts and labor for mechanical defects.
- Fast Response Support: Response within 12 hours and on-site arrival within 72 hours guaranteed.
- Long-term Spare Parts: Supply period of more than 10 years guaranteed for all necessary spare parts.
- Multiple Certifications: Certified with CCC, PSE, FDA, RoHS, ISO, and CE for global compliance.
Product Attributes
- Customization
- Available
- After-sales Service
- 1 Year
- Function
- Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold
- Model NO.
- DA800
- Condition
- New
- Certification
- CCC, PSE, FDA, RoHS, ISO, CE
- Warranty
- 12 Months
- Automatic Grade
- Semiautomatic
- Mould Life
- <300,000 Shots
- Maximum Work Size L*W*H
- 125×300mm*2
- Thickness of Slice
- 1mm~60mm
- out Diameter *Workable Width
- φ165mm±10*400mm*5
- Running Speed
- 1500m/Min
- Lift Speed
- 1500m/Min
- Number of Workbench
- 2
- Fast Feed Speed
- 200mm/Min
- Flow Rate
- 250L/Min
- Weight
- 7500kg
- Floorstrength
- 8000kg Affordable
- Transport Package
- Guangzhou
- Specification
- 3050x1900x2950mm
- Trademark
- minder-hightech
- Origin
- Guangzhou
Product Images of High Precise Single Wire Sawprecision Multi Wire Saw for Silicon Ingot/Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da800
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High Precise Single Wire Sawprecision Multi Wire Saw for Silicon Ingot/Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da800 -
High Precise Single Wire Sawprecision Multi Wire Saw for Silicon Ingot/Sapphire/Quartz Crystal/Ceramics/Silicon Nitride etc Da800
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Product Description
DA800 Multi -wire Saw is a new machine designed with double-workbench and swing workbench to meet the demand for batch processing of super-hard materials such as Sapphire, Quartz Crystal, Special Ceramics, Silicon Nitride into
straight sheets. Five wire guide rollers design is ma in ly used to c ut straight s heets of 0.5mm-60mm thickness.
1-Double cone for wire guide rollers makes loading and
unloading easier.
2-Double cone for the take-up and payoff wheels makes
reliable positioning accuracy.
3-The quantity of wire wheels reduced to 7 to make less wire-broke and more efficient.
4-The mode of3 or5 wire guide rollers is optional to achieve cuttingthick and thin slices.
5-Swing slicing makes stronger cutting force
6-Upside workbench, the workbench moves down.
| Item | Detail | Parameter |
| Ability | Maximum work size L*W*H | 125×300mm*2 |
| Thickness of slice | 1mm~60mm | |
| Spools | Out diameter *Workable width | φ165mm±10*400mm*5 |
| Component | Resin(PE or PU) | |
Diamond wire |
Wire diameter | φ0.12mm-φ0.25mm |
| Storage | 30km(φ0.2mm) | |
| Running speed | 1500m/min | |
Workbench |
Travel of table |
245mm |
| Lift speed | 0.1-99.9mm/min | |
| Fast feed speed | 200mm/min | |
| Number of workbench | 2 | |
Cutting fluid |
Fluid | Cutting Oil |
| Storage | 800L | |
| Flow rate | 250L/min | |
| Power or Air supply | Power or gas supply | Three-phase 380V50Hz 0.35Mpa-600L/min |
| Rated power | <41 kva | |
| Size&Weight | Size | 3050mm*1900mm*2950mm |
| Weight | 7500Kg | |
| Floorstrength | 8000kg Affordable |
Technical Services
There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteed
More than 5 years of domestic technical service experience on similar equipment
After-sale warranty
1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two years
Respond within 12 hours, arrive at the scene within 72 hours.
About the Supplier
This supplier has been audited by SGS. Verify the report on the official SGS website with ID "QIP-ASR2311045". Items marked "
" are certified.
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Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
Since 2014, the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinery equipment.
Our chief technical expert comes from the School of Mechanical Engineering, South China University of Technology, and we are comprised by a group of high educated specialists, experienced engineers and staffs, with excellent professional skills and experience.
We provide the equipment for semiconductor packaging factories and laboratories: Die bonder, Wire bonder, Glue encapsulate machine, Bond tester, Parallel sealing welding machine, Laser sealing welder, Laser solder ball placement, Glove box, Plasma surface treating equipment, etc.
We provide the equipment for semiconductor Fab factories and lab including: DMD maskless Lithography, Mask aligner, Wafer grinder, Wafer mounter, Dincing saw, Reactive ion etching system (RIE), Inductively coupled plasma (ICP), Wafer inspector, and line of laboratory equipment.
We also provide the equipment for electronic and battery pack assembly plants: Soldering machine, Glue dispenser, Terminal insertion machine, Ultrasonic welding machine, PCB cutter, Resistance welder etc.
We are engaged in the trade of microelectronic equipment and semiconductor equipment in Chinese Mainland, not only sell equipment, but also provide you with comprehensive professional solutions and after-sales services.
Until today, our brand's products have spread to major industrialized countries' factory and laboratories around the world, helping customers improve efficiency, reduce costs, and improve product quality.
About Our Factory & Business Background
- Address
- Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
-
Registered Capital
- 1,000,000 RMB
-
Terms of Payment
- T/T
-
International Commercial Terms(Incoterms)
- EXW
-
Average Lead Time
-
Peak Season Lead Time: one month
Off Season Lead Time: one month -
Nearest Port
- Shenzhen Port
Our Production Capability & Technical Expertise
- Main Products
- Wire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
-
R&D Engineers
- 1 people
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2014-12-30
- Export Year
- 2014-12-31
-
Main Markets
- North America, Europe
-
Overseas Agent/Branch
- No
FAQ
- What is the warranty period for the machine?
- We provide a 1-year warranty. After the warranty period, we continue to provide equipment maintenance service once a year for no less than two years.
- How quickly can you respond to technical issues?
- We respond within 12 hours and guarantee to arrive at the scene within 72 hours.
- What materials can this machine cut?
- It is designed for batch processing of super-hard materials such as Sapphire, Quartz Crystal, Special Ceramics, and Silicon Nitrate.
- What is the maximum cutting thickness?
- The machine can cut straight sheets with a thickness ranging from 0.5mm to 60mm.
- Is the wire guide roller configuration customizable?
- Yes, the mode of 3 or 5 wire guide rollers is optional to achieve cutting thick and thin slices.
- How long are spare parts guaranteed to be available?
- A supply period of more than 10 years is guaranteed for all necessary spare parts.
- What is the lead time for this machine?
- The average lead time is one month for both peak and off-peak seasons.
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