High Speed Automatic Series automatic semiconductor wire ball bonder for IC LED package

• After-sales Service: 1 Year
• Condition: New
• Certification: CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Model NO.: MD-S808 MD-S838
• Driven Type: Electric
• Trademark: minder-hightech
• Origin: China
• Production Capacity: 100

Product Description

MD-S series automatic semiconductor wire ball bonder

Speed:

21W/S for 2mm

Welding line area: 56*80mm

Leadframe width: 28-90mm

Application:

IC(SOP,SOT,DIP,BGA,COB.)

LED(SMD,COB)
 

Advantage:

Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption

The chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution

0.1um,+/-2um(High resolution 0.1um worktable, + / - 2um

welding line accuracy)

EFO(High resolution EFO)

(Full closed loop force control)

2.5mil(2.5mil copper wire)

(Optional Automatic conversion of product types)
 

Specification
Bonding Capability	48ms/w 2mm Wire Length
Bongding Speed	+/-2Ym
Wire Length	Max 8mm
Wire Diameter	15-65ym
Wire Type	Au,Ag,Alloy,CuPd,Cu
Bonding Process	/BSOB/BBOS
Looping Control	Ultra Low Looping<50ym
Bonding Area	56*80mm
XY Resolution)	0.1um
Ultrasonic Frequence	138KHZ
PR accuracy	+/-0.37um
Applicable Magazine
(L)	120-305mm
(W)	36-98mm
(H)	50-180mm
(Pitch)	Min 1.5mm
(Applicable Leadframe)
(L)	100-300mm
(W)	28-90mm
(T)	0.1-1.3mm
Conversion Time
Different Leadframe	<15min
Same Leadframe	<4min
Operation Interface
MMI Language	Chinese,Enghise
Dimension, Weight
Overall Dimension)W*D*H	950*920*1850mm
Weight	750KG
Facilities
Voltag	190-240V
Frequency	50Hz
Compressed Air	6-8Bar
Air Consumtion	80L/min

We have 16 years of experience in equipment,
and we can provide you with a one-stop IC Package Line Equipment solution !!