| After-sales Service: | 1 Year |
|---|---|
| Condition: | New |
| Certification: | CE |
|
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Speed:
21W/S for 2mm
Welding line area: 56*80mm
Leadframe width: 28-90mm
Application:
IC(SOP,SOT,DIP,BGA,COB.)
LED(SMD,COB)
Advantage:
Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption
The chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution
0.1um,+/-2um(High resolution 0.1um worktable, + / - 2umwelding line accuracy)
EFO(High resolution EFO)
(Full closed loop force control)
2.5mil(2.5mil copper wire)
(Optional Automatic conversion of product types)
|
Specification |
|
|
Bonding Capability |
48ms/w 2mm Wire Length |
|
Bongding Speed |
+/-2Ym |
|
Wire Length |
Max 8mm |
|
Wire Diameter |
15-65ym |
|
Wire Type |
Au,Ag,Alloy,CuPd,Cu |
|
Bonding Process |
/BSOB/BBOS |
|
Looping Control |
Ultra Low Looping<50ym |
|
Bonding Area |
56*80mm |
|
XY Resolution) |
0.1um |
|
Ultrasonic Frequence |
138KHZ |
|
PR accuracy |
+/-0.37um |
|
Applicable Magazine |
|
|
(L) |
120-305mm |
|
(W) |
36-98mm |
|
(H) |
50-180mm |
|
(Pitch) |
Min 1.5mm |
|
(Applicable Leadframe) |
|
|
(L) |
100-300mm |
|
(W) |
28-90mm |
|
(T) |
0.1-1.3mm |
|
Conversion Time |
|
|
Different Leadframe |
<15min |
|
Same Leadframe |
<4min |
|
Operation Interface |
|
|
MMI Language |
Chinese,Enghise |
|
Dimension, Weight |
|
|
Overall Dimension)W*D*H |
950*920*1850mm |
|
Weight |
750KG |
|
Facilities |
|
|
Voltag |
190-240V |
|
Frequency |
50Hz |
|
Compressed Air |
6-8Bar |
|
Air Consumtion |
80L/min |
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