• Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550
  • Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550
  • Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550
  • Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550
  • Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550
  • Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550

Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550

Transport Package: Plywood Packing by Fast Express
Specification: 70kg
Trademark: minder-hightech
Origin: Guangzhou

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Basic Info.

Model NO.
mdb-7550
HS Code
8515809090
Production Capacity
500/Year

Product Description

Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550 Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550 Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550 Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550 Manual Ultrasonic Wedge Wire Bonding Machine Mdb7550

Application:

High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment,auto sensors, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.

Specification:

1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 2,aluminium wire diameter:75~500μm (3~20mil)
3,ultrasonic power:0-30W, two channel.can be set separately of the two point 4,bond time:10-500ms,two channel
5,bond force:30-1200g,two channel
6,motorized Y:0-18mm
7,microscope rate:7.5 and 15
8,working area:Φ25mm
9,light:adjustable brightness
10,size:620×610×560mm
11,weight:~40kg 
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guangzhou minder-hightech co.,ltd
contact:shunyu.hu  
 
cellphone//:0086-15813334038
 

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