Guangdong, China
Main Products:
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
Number of Foreign Trading Staff:
4
Sample Available
Wire Bonder, Soldering Machine, Vacuum Pump manufacturer / supplier in China, offering Semiconductor Fab Wafer Flattening Removing Nanoscale Planarization Chemical Mechanical Planarization CMP Process, Semiconductor Thinning Polishing High Precision Wafer Surface CMP Chemical Mechanical Planarization Equipment, Semiconductor Wafer Surface Precision Chemical Mechanical Planarization CMP and so on.
Diamond Member
Since 2017
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