Guangdong, China
Main Products:
Year of Establishment:
2014-12-30
Address:
Room 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital:
1,000,000 RMB
Main Markets:
North America, Europe
Number of Foreign Trading Staff:
4
Sample Available
Wire Bonder, Soldering Machine, Vacuum Pump manufacturer / supplier in China, offering Semiconductor Substrate Wafer Laser Scribing Dicing Cleaving Precision Cutting Machine, Silicon Carbide Stealth Laser Cutting / Semiconductor Wafer Laser Scribing and Dicing Equipment, Semiconductor 4/6/8 Inch Wafer Stealth Laser Dicing Saw / Semiconductor Substrate High Precision Automatic Positioning Silicon Wafer Modification Cut and so on.
Diamond Member
Audited Supplier
